SCHEMBL4802647

SCHEMBL4802647

CC(C)(C)N[Ta]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49646 0.62
SCHEMBL49720 0.62
SCHEMBL5925136 0.59
SCHEMBL1794632 0.59
Hydrochloric Acid SCHEMBL6065121 0.59
Water SCHEMBL23525631 0.59
SCHEMBL6700452 0.59
SCHEMBL189693 0.59
SCHEMBL20838448 0.59
Fluoride SCHEMBL1057439 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112442674-A Method and apparatus for depositing chalcogenide films and structures including films ASM IP私人控股有限公司 2021-03-05 CN claimed
US-20210066080-A1 METHODS AND APPARATUS FOR DEPOSITING A CHALCOGENIDE FILM AND STRUCTURES INCLUDING THE FILM ASM IP HOLDING B.V. (NL) 2021-03-04 US claimed
US-9324606-B2 Self-aligned repairing process for barrier layer TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2016-04-26 US claimed
US-20150194343-A1 SELF-ALIGNED REPAIRING PROCESS FOR BARRIER LAYER TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2015-07-09 US claimed
US-20150179937-A1 Metal Organic Chemical Vapor Deposition of Embedded Resistors for ReRAM Cells INTERMOLECULAR INC. (US) 2015-06-25 US claimed
US-20140175367-A1 Materials for Thin Resisive Switching Layers of Re-RAM Cells INTERMOLECULAR INC. (US) 2014-06-26 US claimed
US-7459392-B2 Noble metal barrier and seed layer for semiconductors INTEL CORPORATION (US) 2008-12-02 US claimed
US-20060220249-A1 Nobel metal barrier and seed layer for semiconductors INTEL CORPORATION 2006-10-05 US claimed
CN-115584491-B Organoaminopolysiloxanes for deposition of silicon-containing films 弗萨姆材料美国有限责任公司 2024-11-08 CN disclosed
CN-118231149-A Solid aluminum electrolytic capacitor and preparation method and application thereof 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) 2024-06-21 CN disclosed
CN-113168966-B Solid electrolytic capacitor containing sequentially vapor deposited dielectric films 京瓷AVX元器件公司 2024-01-16 CN disclosed
CN-116854727-A Process for preparing metal dialkylamido halides, iminotris (dialkylamido) metal complexes and device system therefor 天津绿菱气体有限公司 2023-10-10 CN disclosed
CN-116583621-A Complexes of lanthanide and lanthanide-like transition metals 默克专利股份有限公司 2023-08-11 CN disclosed
CN-108615703-B Interconnect with fully clad wire 太浩研究有限公司 2023-02-17 CN disclosed
US-20140175367-A1 Materials for Thin Resisive Switching Layers of Re-RAM Cells INTERMOLECULAR INC. (US) 2014-06-26 US disclosed
US-20140175360-A1 Bilayered Oxide Structures for ReRAM Cells INTERMOLECULAR INC. (US) 2014-06-26 US disclosed
US-20140175355-A1 Carbon Doped Resistive Switching Layers INTERMOLECULAR INC. (US) 2014-06-26 US disclosed
US-8726838-B2 Combinatorial plasma enhanced deposition and etch techniques INTERMOLECULAR, INC. (US) 2014-05-20 US disclosed
CN-102046839-B Method for making oriented tantalum pentoxide films MICRON TECHNOLOGY INC 2013-06-26 CN disclosed
CN-102046839-A Method for making oriented tantalum pentoxide films MICRON TECHNOLOGY INC 2011-05-04 CN disclosed