Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4807210 | 0.86 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL1664611 | 0.82 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL4806035 | 0.80 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL3300371 | 0.79 | — | — | |
| SCHEMBL10927465 | 0.77 | — | — | |
| SCHEMBL10071754 | 0.76 | PTGS1 (0.32) | PTGS1PTGS2 | |
| SCHEMBL1996554 | 0.76 | — | — | |
| SCHEMBL17530140 | 0.75 | PTGS1 (0.31) | PTGS1PTGS2 | |
| SCHEMBL17530130 | 0.75 | — | — | |
| SCHEMBL17530148 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117480273-A | Primer composition for vapor deposition of inorganic oxide, cured product, and laminate | DIC株式会社 | 2024-01-30 | — | — | CN | disclosed |
| WO-2023171514-A1 | LAMINATE AND PACKAGING MATERIAL | DIC株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2022264906-A1 | PRIMER COMPOSITION FOR INORGANIC OXIDE VAPOR DEPOSITION, CURED PRODUCT AND MULTILAYER BODY | DIC株式会社 | 2022-12-22 | — | — | WO | disclosed |
| EP-2990433-B1 | INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT | DAINIPPON INK & CHEMICALS (JP) | 2022-03-09 | — | — | EP | disclosed |
| EP-3213915-B1 | LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20170253965-A1 | LAMINATE | DIC CORPORATION (JP) | 2017-09-07 | — | — | US | disclosed |
| EP-3213915-A1 | LAMINATE | DIC Corporation (JP) | 2017-09-06 | — | — | EP | disclosed |
| US-20160137879-A1 | INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT | DIC CORPORATION (JP) | 2016-05-19 | — | — | US | disclosed |
| EP-2990433-A1 | INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT | DIC Corporation (JP) | 2016-03-02 | — | — | EP | disclosed |
| US-20140061970-A1 | NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN | DIC CORPORATION (JP) | 2014-03-06 | — | — | US | disclosed |
| US-20130012669-A1 | THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF | CHI MEI CORPORATION (TW) | 2013-01-10 | — | — | US | disclosed |
| CN-102863742-A | Thermosetting resin composition and application thereof | CHI MEI CORP | 2013-01-09 | — | — | CN | disclosed |
| US-7435668-B2 | Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions | SONY CORPORATION (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7335539-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20070298550-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7273774-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-09-25 | — | — | US | disclosed |
| US-20060079033-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| US-20050181566-A1 | Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus | SONY CORPORATION (JP) | 2005-08-18 | — | — | US | disclosed |
| US-6039896-A | RESINS, ORGANIC PEROXIDE, THERMOPLASTIC ELASTOMERS AND PHOSPHORIC ESTERS | SUMITOMO BAKELITE CO., LTD. (JP) | 2000-03-21 | — | — | US | disclosed |