SCHEMBL4806772

SCHEMBL4806772

CCCCOC(C)COCCOCCO

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.57
MEN1 O00255 3/20 0.52
KMT2A Q03164 3/20 0.52
HTT P42858 2/20 0.52
THRB P10828 1/20 0.52
MAPT P10636 1/20 0.52
TDP1 Q9NUW8 1/20 0.47
USP2 O75604 2/20 0.40
MAPK1 P28482 2/20 0.40
ALDH1A1 P00352 2/20 0.40
LMNA P02545 1/20 0.40
CYP3A4 P08684 1/20 0.40
CASP1 P29466 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
SLCO1B3 Q9NPD5 1/20 0.40
SLCO1B1 Q9Y6L6 1/20 0.40
HSD17B10 Q99714 1/20 0.36
LPAR1 Q92633 4/20 0.35
LPAR3 Q9UBY5 4/20 0.35
LPAR2 Q9HBW0 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7181445 0.96 TSHR (0.56) TSHRMEN1KMT2AHTTTHRB
SCHEMBL11457821 0.95 TSHR (0.61) TSHRMEN1KMT2AHTTTHRB
SCHEMBL11470088 0.95 TSHR (0.61) TSHRMEN1KMT2AHTTTHRB
SCHEMBL3590634 0.93 MEN1 (0.63) TSHRMEN1KMT2AHTTTHRB
SCHEMBL14503244 0.91 TSHR (0.57) TSHRMEN1KMT2AHTTTHRB
SCHEMBL17206873 0.91 TSHR (0.55) TSHRMEN1KMT2AHTTTHRB
SCHEMBL10484508 0.91 HTT (0.53) TSHRMEN1KMT2AHTTTHRB
SCHEMBL28161776 0.89 HTT (0.57) TSHRMEN1KMT2AHTTTHRB
SCHEMBL8617152 0.89 TSHR (0.56) TSHRMEN1KMT2AHTTTHRB
Ethylene Glycol SCHEMBL6756784 0.89 TDP1 (0.50) TSHRMEN1KMT2AHTTTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 WO disclosed