SCHEMBL4810335

SCHEMBL4810335

COC([SiH3])(CCCCOCC1CO1)OC

nearest known ligand 0.60

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.60
ALDH1A1 P00352 4/20 0.54
TDP1 Q9NUW8 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.53
MAPK1 P28482 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL517669 0.95 TSHR (0.57) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL7920440 0.88 TSHR (0.50) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL4812336 0.84 TSHR (0.56) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL1093579 0.82 TSHR (0.58) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL329017 0.82 TSHR (0.53) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL230973 0.81 TSHR (0.56) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL27958344 0.79 TSHR (0.69) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL465572 0.79 SMN1; SMN2 (0.56) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL4806196 0.78 TSHR (0.53) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL22492690 0.78 TSHR (0.49) TSHRALDH1A1TDP1SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
WO-2023171514-A1 LAMINATE AND PACKAGING MATERIAL DIC株式会社 2023-09-14 WO disclosed
WO-2022264906-A1 PRIMER COMPOSITION FOR INORGANIC OXIDE VAPOR DEPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC株式会社 2022-12-22 WO disclosed
WO-2020066993-A1 COMPOSITION, CURED OBJECT, LAMINATE, AND LIGHT RESISTANT COATING MATERIAL DIC株式会社 2020-04-02 WO disclosed
EP-3213915-B1 LAMINATE DAINIPPON INK & CHEMICALS (JP) 2019-08-14 EP disclosed
US-20170253965-A1 LAMINATE DIC CORPORATION (JP) 2017-09-07 US disclosed
EP-3213915-A1 LAMINATE DIC Corporation (JP) 2017-09-06 EP disclosed
US-20140061970-A1 NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN DIC CORPORATION (JP) 2014-03-06 US disclosed
US-7435668-B2 Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions SONY CORPORATION (JP) 2008-10-14 US disclosed
US-7335539-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2008-02-26 US disclosed
US-20070298550-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-12-27 US disclosed
US-7273774-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-09-25 US disclosed
US-20060079033-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2006-04-13 US disclosed
US-20050181566-A1 Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus SONY CORPORATION (JP) 2005-08-18 US disclosed