SCHEMBL4829496

SCHEMBL4829496

O=CC[SnH].[NaH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11241012 0.64
Malonaldehyde SCHEMBL2429722 0.63
SCHEMBL9301776 0.63
Malonaldehyde SCHEMBL9478503 0.63
Malonaldehyde SCHEMBL7048796 0.60
Propionaldehyde SCHEMBL9135951 0.60
SCHEMBL9001123 0.60
SCHEMBL1243203 0.60
SCHEMBL29281298 0.60
SCHEMBL29092198 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1391476-B1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2015-12-09 EP disclosed
US-7419527-B2 Increased density particle molding PARTICLE SCIENCES, INC. (US) 2008-09-02 US disclosed
US-7312013-B2 Photoreactive composition SEKISUI CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
WO-2004101200-A2 INCREASED DENSITY PARTICLE MOLDING PARTICLE SCIENCES, INC. (US) 2004-11-25 WO disclosed
US-20040221682-A1 Increased density particle molding PARTICLE SCIENCES, INC. 2004-11-11 US disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed
EP-1017746-B1 HYDROPHILIC MATERIALS AND THEIR METHOD OF PREPARATION SUNSMART INC (US) 2002-12-11 EP disclosed
US-6413548-B1 SPHERES; SUSTAINED RELEASE AVEKA, INC. 2002-07-02 US disclosed
WO-2001085138-A2 PARTICULATE ENCAPSULATION OF LIQUID BEADS AVEKA, INC. (US) 2001-11-15 WO disclosed
US-6139613-A Multilayer pigments and their manufacture AVEKA, INC. (US) 2000-10-31 US disclosed
EP-1017746-A1 HYDROPHILIC MATERIALS AND THEIR METHOD OF PREPARATION SUNSMART, INC. (US) 2000-07-12 EP disclosed
US-6045650-A A LIQUID COATING OF AN OXIDIZABLE MATERIAL CONTAINING AT LEAST ONE ELEMENT OTHER THAN CARBON, HYDROGEN, OXYGEN AND NITROGEN IS APPLIED ONTO THE SURFACE OF A SUBSTRATE, OXIDIZING THE OXIDIZABLE MATERIAL TO FORM AN OXIDE COATING SUNSMART, INC. (US) 2000-04-04 US disclosed
US-5962082-A Process for applying liquid coatings to solid particulate substrates AVEKA, INC. (US) 1999-10-05 US disclosed
WO-1999014276-A1 HYDROPHILIC MATERIALS AND THEIR METHOD OF PREPARATION SUNSMART, INC. (US) 1999-03-25 WO disclosed