⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL483065 | 0.96 | — | — | |
| SCHEMBL483085 | 0.83 | — | — | |
| SCHEMBL599447 | 0.82 | S1PR1 (0.33) | — | |
| SCHEMBL482719 | 0.82 | PSEN1 (0.41) | — | |
| SCHEMBL483248 | 0.80 | CYP2C19 (0.36) | — | |
| SCHEMBL599113 | 0.79 | S1PR1 (0.35) | — | |
| SCHEMBL483332 | 0.79 | CNR1 (0.31) | — | |
| SCHEMBL29104883 | 0.79 | — | — | |
| SCHEMBL30661251 | 0.78 | KCNH2 (0.31) | — | |
| SCHEMBL482872 | 0.77 | PSEN1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-113383273-B | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2023-11-14 | — | — | CN | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-1341040-A1 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 2003-09-03 | — | — | EP | disclosed |
| US-20030091933-A1 | Photosensitive composition and negative working lithographic printing plate | FUJIFILM CORPORATION (JP) | 2003-05-15 | — | — | US | disclosed |
| US-20030084806-A1 | FINE PARTICLES CONTAINING A RADICAL POLYMERIZABLE ENCAPSULATED BY MICROCAPSULES | FUJIFILM CORPORATION (JP) | 2003-05-08 | — | — | US | disclosed |
| EP-1288720-A1 | Plate-making method of printing plate | FUJI PHOTO FILM CO., LTD. (JP) | 2003-03-05 | — | — | EP | disclosed |
| EP-1249731-A2 | Photosensitive composition and negative working lithographic printing plate | FUJI PHOTO FILM CO., LTD. (JP) | 2002-10-16 | — | — | EP | disclosed |
| EP-1238801-A2 | Lithographic printing plate precursor | FUJI PHOTO FILM CO., LTD. (JP) | 2002-09-11 | — | — | EP | disclosed |
| EP-0860741-B1 | Photopolymerizable composition | FUJI PHOTO FILM CO LTD (JP) | 2001-05-16 | — | — | EP | disclosed |
| US-6051367-A | COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH | FUJI PHOTO FILM CO., LTD. (JP) | 2000-04-18 | — | — | US | disclosed |
| EP-0860741-A1 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 1998-08-26 | — | — | EP | disclosed |
| US-5026625-A | Photoinitiators for polymerization of ethylenically unsaturated compounds | CIBA-GEIGY CORPORATION (US) | 1991-06-25 | — | — | US | disclosed |