SCHEMBL4863977

SCHEMBL4863977

C=COC(F)(F)C(F)(F)C(F)(F)CF

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8383461 0.91
SCHEMBL3951521 0.85
SCHEMBL2804726 0.79
SCHEMBL28600 0.74
SCHEMBL5563899 0.73
SCHEMBL7211700 0.73
SCHEMBL1116141 0.72
SCHEMBL6131431 0.72
SCHEMBL8383466 0.71
SCHEMBL3841859 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7378224-B2 Method for forming pattern, and optical element JSR CORPORATION (JP) 2008-05-27 US disclosed
EP-1296186-B1 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORP (JP) 2006-06-07 EP disclosed
US-6852476-B2 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORPORATION (JP) 2005-02-08 US disclosed
US-20050014100-A1 Method for forming pattern, and optical element JSR CORPORATION (JP) 2005-01-20 US disclosed
EP-1498776-A2 Method for forming pattern, and optical element JSR Corporation (JP) 2005-01-19 EP disclosed
WO-2002023274-A9 PHOTORESIST COMPOSITION SHIPLEY CO LLC (US) 2003-11-13 WO disclosed
US-6645695-B2 Crosslinked polymeric particles and a photoactive component, wherein the polymeric particles comprise cleavable group(s); free of surfactant; forming relief images SHIPLEY COMPANY, L.L.C. 2003-11-11 US disclosed
US-20030068574-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORPORATION (JP) 2003-04-10 US disclosed
EP-1296186-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR Corporation (JP) 2003-03-26 EP disclosed
US-20020051928-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2002-05-02 US disclosed
WO-2002023274-A2 PHOTORESIST COMPOSITION SHIPLEY COMPANY, L.L.C. (US) 2002-03-21 WO disclosed
EP-0338498-A2 Process for preparing fluorine-containing copolymers DAIKIN INDUSTRIES, LIMITED (JP) 1989-10-25 EP disclosed
EP-0335361-A2 Electrodeposition coating composition KANSAI PAINT CO., LTD. (JP) 1989-10-04 EP disclosed