Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FABP3 | P05413 | 7/20 | 0.60 |
| ▸ | CA1 | P00915 | 1/20 | 0.58 |
| ▸ | CES2 | O00748 | 4/20 | 0.54 |
| ▸ | CES1 | P23141 | 4/20 | 0.54 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.48 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Behenic Acid SCHEMBL28815262 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Dodecanoate SCHEMBL29785432 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Myristic Acid SCHEMBL9245302 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Stearic Acid SCHEMBL900922 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Heptanoate SCHEMBL8361326 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Tridecanoate SCHEMBL5459906 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Palmitic Acid SCHEMBL2452648 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Dodecanoate SCHEMBL35315 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Nonanoate SCHEMBL8365974 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 | |
| Dodecanoate SCHEMBL27565199 | 1.00 | FABP3 (0.60) | FABP3CA1CES2CES1NFKB1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024127822-A1 | PHOTOCURABLE RESIN COMPOSITION | 株式会社スリーボンド | 2024-06-20 | — | — | WO | disclosed |
| WO-2024116877-A1 | PHOTOCURABLE RESIN COMPOSITION | 株式会社スリーボンド | 2024-06-06 | — | — | WO | disclosed |
| US-20240166862-A1 | TWO-COMPONENT CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | THREEBOND CO., LTD. (JP) | 2024-05-23 | — | — | US | disclosed |
| EP-4361217-A1 | MOISTURE-CURABLE RESIN COMPOSITION | ThreeBond Co., Ltd. (JP) | 2024-05-01 | — | — | EP | disclosed |
| WO-2024057920-A1 | TWO COMPONENT CURABLE RESIN COMPOSITION FOR HYDROGEN GAS SEALING, AND CURED PRODUCT OF SAME | 株式会社スリーボンド | 2024-03-21 | — | — | WO | disclosed |
| WO-2024048455-A1 | MOISTURE-CURABLE RESIN COMPOSITION | 株式会社スリーボンド | 2024-03-07 | — | — | WO | disclosed |
| EP-4321587-A1 | TWO-PART CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | ThreeBond Co., Ltd. (JP) | 2024-02-14 | — | — | EP | disclosed |
| US-11879077-B2 | Thermally conductive moisture-curable resin composition and cured product thereof | THREEBOND CO., LTD. (JP) | 2024-01-23 | — | — | US | disclosed |
| CN-117413018-A | Moisture-curable resin composition | 三键有限公司 | 2024-01-16 | — | — | CN | disclosed |
| CN-116997609-A | Two-component curable resin composition and cured product thereof | 三键有限公司 | 2023-11-03 | — | — | CN | disclosed |
| WO-2023149328-A1 | TWO-COMPONENT THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT | 株式会社スリーボンド | 2023-08-10 | — | — | WO | disclosed |
| CN-111615539-B | Heat-conductive moisture-curable resin composition and cured product thereof | 三键有限公司 | 2022-08-02 | — | — | CN | disclosed |
| US-20210087442-A1 | THERMALLY CONDUCTIVE MOISTURE-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | THREEBOND CO., LTD. (JP) | 2021-03-25 | — | — | US | disclosed |
| CN-111615539-A | Heat-conductive moisture-curable resin composition and cured product thereof | 三键有限公司 | 2020-09-01 | — | — | CN | disclosed |
| US-7449519-B2 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2008-11-11 | — | — | US | disclosed |
| US-20060079605-A1 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2006-04-13 | — | — | US | disclosed |
| EP-1616886-A1 | CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION | Konishi Co., Ltd. (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-6383648-B1 | ACRYLIC COPOLYMER WITH SILYLOXY GROUP, HYDROLYZATE CONDENSATE OF ORGANOSILICON COMPOUND, AND POLYISOCYANATE CROSSLINKING AGENT; SOLVENT RESISTANCE, ANTISOILANTS, ADHESIVES, SHRINKAGE INHIBITION, IMPACT STRENGTH | KANEKA CORPORATION (JP) | 2002-05-07 | — | — | US | disclosed |
| EP-0974629-A1 | CURABLE COMPOSITION FOR TOPCOATING AND ARTICLES COATED THEREWITH | Kaneka Corporation (JP) | 2000-01-26 | — | — | EP | disclosed |