SCHEMBL4870939

SCHEMBL4870939

CCOC(C1=CCCC1)=C(C(=O)O)C1=CCCC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 2/20 0.39
HDAC2 Q92769 2/20 0.39
HDAC8 Q9BY41 2/20 0.39
HDAC6 Q9UBN7 2/20 0.39
HDAC3 O15379 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC7 Q8WUI4 1/20 0.39
HDAC5 Q9UQL6 1/20 0.39
CTSK P43235 1/20 0.35
GSTP1 P09211 1/20 0.33
CHRNB2 P17787 1/20 0.31
CHRNA4 P43681 1/20 0.31
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA7 P43166 1/20 0.31
CA9 Q16790 1/20 0.31
CA14 Q9ULX7 1/20 0.31
ALDH1A1 P00352 3/20 0.30
NR1H2 P55055 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28839447 0.84 HDAC4 (0.39) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL11216548 0.84 HDAC4 (0.36) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL340678 0.78 HDAC4 (0.47) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL8939555 0.77 HDAC2 (0.54) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL8939554 0.77 HDAC2 (0.54) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL15665965 0.76 HDAC4 (0.34) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL11001766 0.76 HDAC4 (0.42) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL25318618 0.75 HDAC4 (0.39) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL6538023 0.73 HDAC4 (0.40) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL6049107 0.73 HDAC4 (0.48) HDAC4HDAC2HDAC8HDAC6HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115236939-A Positive photoresist composition for organic insulating film of high-aperture-ratio liquid crystal display element 烟台希尔德材料科技有限公司 2022-10-25 CN claimed
US-7364833-B2 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG ELECTRONICS CO., LTD (KR) 2008-04-29 US claimed
US-20050266339-A1 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG DISPLAY CO., LTD. (KR) 2005-12-01 US claimed
WO-2004107052-A1 NEGATIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO claimed
US-4388434-A ACRYLIC ESTER POLYMERS ROHM AND HAAS COMPANY (US) 1983-06-14 US claimed
CN-118344518-A Acrylic resin and UV heating dual-curing adhesive and preparation method thereof 深圳市勇泰运科技有限公司 2024-07-16 CN disclosed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-116376357-A Stable printing material 科迪华公司 2023-07-04 CN disclosed
CN-113423789-B Stabilized printing material 科迪华公司 2023-04-07 CN disclosed
CN-115236939-A Positive photoresist composition for organic insulating film of high-aperture-ratio liquid crystal display element 烟台希尔德材料科技有限公司 2022-10-25 CN disclosed
CN-114245818-A Curable composition 佳能株式会社 2022-03-25 CN disclosed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO disclosed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO disclosed
EP-0618244-B1 Multiple curable composition and use thereof NAT STARCH CHEM INVEST (US) 1998-07-15 EP disclosed
EP-0549116-B1 Method for coating printed circuit boards NAT STARCH CHEM INVEST (US) 1998-02-04 EP disclosed
EP-0618244-A2 Multiple curable composition and use thereof W.R. GRACE & CO.-CONN. (US) 1994-10-05 EP disclosed
US-5234970-A Conformal coatings W. R. GRACE & CO.-CONN. (US) 1993-08-10 US disclosed
EP-0549116-A2 Dual curing composition and use thereof W.R. Grace & Co.-Conn. (US) 1993-06-30 EP disclosed