Known targets — ChEMBL curated mechanism
CHRM1DRD2DRD3DRD4HDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR2APDE3ASIGMAR1
The experimentally established mechanism targets of Lactic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Lactic Acid SCHEMBL3233913 | 0.92 | — | — | |
| Lactic Acid SCHEMBL6277885 | 0.92 | — | — | |
| Lactic Acid SCHEMBL5189465 | 0.92 | TP53 (1.00) | — | |
| Lactic Acid SCHEMBL180386 | 0.92 | TP53 (1.00) | — | |
| Lactic Acid SCHEMBL1412661 | 0.92 | TP53 (1.00) | — | |
| Lactic Acid SCHEMBL9066423 | 0.92 | TP53 (1.00) | — | |
| L-Lactic Acid SCHEMBL13165963 | 0.92 | — | — | |
| Lactic Acid SCHEMBL9066424 | 0.92 | — | — | |
| D-Lactic Acid SCHEMBL14947 | 0.92 | — | — | |
| D-Lactic Acid SCHEMBL4371722 | 0.92 | TP53 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6413923-B1 | — | — | None | — | — | US | claimed |
| CN-115536602-A | Preparation method of posaconazole intermediate | 成都海博为药业有限公司 | 2022-12-30 | — | — | CN | claimed |
| US-7402552-B2 | Non-corrosive cleaning composition for removing plasma etching residues | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-07-22 | — | — | US | claimed |
| EP-1230334-B1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-09-20 | — | — | EP | claimed |
| EP-1141444-B1 | NOVEL COMPOSITION FOR SELECTIVE ETCHING OF OXIDES OVER METALS | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-06-14 | — | — | EP | claimed |
| US-20060094614-A1 | Non-corrosive cleaning composition for removing plasma etching residues | ARCH SPECIALTY CHEMICALS, INC. | 2006-05-04 | — | — | US | claimed |
| US-7001874-B2 | Non-corrosive cleaning composition for removing plasma etching residues | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-02-21 | — | — | US | claimed |
| EP-1230334-A4 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | ARCH SPEC CHEM INC (US) | 2004-08-11 | — | — | EP | claimed |
| EP-1141444-A4 | NOVEL COMPOSITION FOR SELECTIVE ETCHING OF OXIDES OVER METALS | ARCH SPEC CHEM INC (US) | 2004-05-26 | — | — | EP | claimed |
| US-20020132745-A1 | Non-corrosive cleaning composition for removing plasma etching residues | ARCH SPECIALTY CHEMICALS | 2002-09-19 | — | — | US | claimed |
| EP-1230334-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-08-14 | — | — | EP | claimed |
| US-6413923-B2 | A CLEANING COMPOSITION FOR REMOVING PLASMA ETCH RESIDUES FORMED ON A SUBSTRATE WHICH COMPRISES WATER, ATLEAST ONE HYDROXYLAMMONIUM INORGANIC OR ORGANIC COMPOUND, A BASIC COMPOUND AND AN ORGANIC CARBOXYLLIC ACID | ARCH SPECIALTY CHEMICALS, INC. | 2002-07-02 | — | — | US | claimed |
| US-6361712-B1 | COMPRISED OF WATER, HYDROXYLAMMONIUM SALT, CARBOXYLIC ACID, FLUORINE-CONTAINING COMPOUNDS, AND BASE; REMOVES RESIDUES LEFT AFTER CHEMICAL-MECHANICAL POLISHING AND ETCHING | ARCH SPECIALTY CHEMICALS, INC. | 2002-03-26 | — | — | US | claimed |
| US-20010032829-A1 | Novel composition for selective etching of oxides over metals | ARCH SPECIALTY CHEMICALS | 2001-10-25 | — | — | US | claimed |
| EP-1141444-A1 | NOVEL COMPOSITION FOR SELECTIVE ETCHING OF OXIDES OVER METALS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-10-10 | — | — | EP | claimed |
| WO-2001036578-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-05-25 | — | — | WO | claimed |
| US-20010001785-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | KENJI HONDA | 2001-05-24 | — | — | US | claimed |
| WO-2001029284-A1 | NOVEL COMPOSITION FOR SELECTIVE ETCHING OF OXIDES OVER METALS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-04-26 | — | — | WO | claimed |
| EP-1141444-B1 | NOVEL COMPOSITION FOR SELECTIVE ETCHING OF OXIDES OVER METALS | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-06-14 | — | — | EP | disclosed |
| US-4150744-A | Packaging | SMITH & NEPHEW PHARMACEUTICALS LTD. (GB) | 1979-04-24 | — | — | US | disclosed |