SCHEMBL487454

SCHEMBL487454

CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.CCOC(=O)CC(C)=O.[Zr]

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.70
MGAM O43451 2/20 0.70
SI P14410 2/20 0.70
MGAM2 Q2M2H8 2/20 0.70
ALDH1A1 P00352 5/20 0.50
LMNA P02545 1/20 0.50
HSD17B10 Q99714 1/20 0.50
TRPA1 O75762 1/20 0.50
CYP1A2 P05177 1/20 0.43
ALOX15 P16050 2/20 0.42
SOAT1 P35610 1/20 0.42
KDM4E B2RXH2 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
TSHR P16473 1/20 0.39
MAPT P10636 1/20 0.39
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CA9 Q16790 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2790815 1.00 GAA (0.70) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL516436 1.00 GAA (0.70) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL398512 1.00 GAA (0.70) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL28159162 0.97 GAA (0.67) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1330478 0.97
SCHEMBL1331762 0.97
SCHEMBL1332259 0.97
SCHEMBL1331371 0.97
SCHEMBL1331782 0.97
SCHEMBL15500 0.97

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4715465-A1 MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER Nissan Chemical Corporation (JP) 2026-03-25 EP disclosed
EP-4679175-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM Nissan Chemical Corporation (JP) 2026-01-14 EP disclosed
US-20240419073-A1 ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-12-19 US disclosed
WO-2024063135-A1 COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAM RECORDING MEDIUM, OPTICAL MATERIAL, AND OPTICAL COMPONENT 三菱ケミカル株式会社 2024-03-28 WO disclosed
US-11884839-B2 Acetal-protected silanol group-containing polysiloxane composition NISSAN CHEMICAL CORPORATION (JP) 2024-01-30 US disclosed
WO-2024005140-A1 COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAPHIC RECORDING MEDIUM, OPTICAL MATERIAL AND OPTICAL COMPONENT 三菱ケミカル株式会社 2024-01-04 WO disclosed
US-11488824-B2 Method for manufacturing semiconductor device using silicon-containing resist underlayer film forming composition for solvent development NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2022-11-01 US disclosed
US-20220155688-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
CN-111247193-B Method for producing organopolysiloxane, radiation-curable organopolysiloxane composition, and release sheet 信越化学工业株式会社 2022-04-12 CN disclosed
EP-3144139-B1 NON-FLAMMABLE SHEET AND PRODUCTION METHOD THEREFOR TOPPAN PRINTING CO LTD (JP) 2021-06-23 EP disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed
US-6111044-A CONTAINS A RESIN HAVING AT LEAST ONE FUNCTIONAL GROUP SELECTED FROM THE GROUP CONSISTING OF A BLOCKED HYDROXYL GROUP, BLOCKED CARBOXYLIC ACID, AND AN EPOXY GROUP NOF CORPORATION (JP) 2000-08-29 US disclosed
US-5929140-A AN ALIPHATIC HYDROCARBON SOLVENT, AN ACRYLIC POLYMER CONTAINING LACTONE REPEATING UNIT, A POLYMER FINE PARTICLES INSOLUBLE IN ABOVE ORGANIC SOLVENT AND A CROSSLINKING AGENT; WATER RESISTANCE, WEATHERPROOFING AND CHEMICAL RESISTNCE NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1999-07-27 US disclosed
US-5623030-A Curable composition and process for producing molded articles using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1997-04-22 US disclosed
EP-0714962-A1 COATING RESIN COMPOSITION NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1996-06-05 EP disclosed
EP-0512562-B1 Method of forming coating films KANSAI PAINT CO LTD (JP) 1995-09-27 EP disclosed
US-5393629-A Consists of a conductive support having ligth sensitive layerc containing hydroxygallium phthalocyanine crystals as charge generating material and a charge transporting layer, and a benzidine compound FUJI XEROX CO., LTD. (JP) 1995-02-28 US disclosed
US-5366768-A Method of forming coating films KANSAI PAINT COMPANY, LIMITED (JP) 1994-11-22 US disclosed
EP-0512562-A2 Method of forming coating films KANSAI PAINT CO., LTD. (JP) 1992-11-11 EP disclosed
EP-0358238-A2 Resin compositions and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1990-03-14 EP disclosed