SCHEMBL4882582

SCHEMBL4882582

CCCCC(CCCC)(CCCC)C(=O)CC(=O)[O-].CCCCC(CCCC)(CCCC)C(=O)CC(=O)[O-].CCCCC(CCCC)(CCCC)C(=O)CC(=O)[O-].[Al+3]

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.41
CA4 P22748 2/20 0.36
CES2 O00748 5/20 0.36
CES1 P23141 5/20 0.36
FFAR3 O14843 2/20 0.36
HDAC3 O15379 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
HDAC8 Q9BY41 2/20 0.36
EPHX1 P07099 3/20 0.34
FABP3 P05413 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10824720 0.88 EPHX1 (0.41) CA1CES2CES1EPHX1FABP3
SCHEMBL6905695 0.87 CA4 (0.39) CA1CA4CES2CES1FFAR3
SCHEMBL28906293 0.78 AKR1B1 (0.41) EPHX1FABP3
SCHEMBL237875 0.78 CA4 (0.43) CA1CA4FFAR3HDAC3HDAC1
SCHEMBL4882584 0.77 AKR1B1 (0.39) EPHX1FABP3
SCHEMBL1924420 0.75 CA1 (0.38) CA1CA4CES2CES1FFAR3
SCHEMBL28927256 0.74 CA1 (0.39) CA1CES2CES1FFAR3HDAC3
SCHEMBL8078154 0.73 CA1 (0.42) CA1CES2CES1FFAR3HDAC3
SCHEMBL20506735 0.73 CA4 (0.43) CA1CA4FFAR3HDAC3HDAC1
SCHEMBL8089554 0.73 CA1 (0.42) CA1CES2CES1FFAR3HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8431681-B2 Polyester modified vinyl polymer with organometallic compound and organosilicon compound ORIGIN ELECTRIC COMPANY, LIMITED (JP) 2013-04-30 US disclosed
US-20080199705-A1 COATING COMPOSITION AND COAT ARTICLE COATED THEREWITH ORIGIN ELECTRIC COMPANY, LIMITED (JP) 2008-08-21 US disclosed
US-20040183215-A1 Electronic device using coating epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 2004-09-23 US disclosed
US-6048617-A RESIN COATED WITH COMPOSITION CONTAINING ACRYLIC POLYMER CONTAINING NO HYDROXYL GRPOUP, A COMPLEX HAVING OXYGEN LIGANDS, SILANOL OR PRECURSOR, AND UV ABSORBER; COATINGFOR AUTOMOBILE HEAD LAMPS ORIGIN ELECTRIC COMPANY, LIMITED (JP) 2000-04-11 US disclosed
EP-0779327-A1 SURFACE-COATED MOLDED PLASTIC ARTICLES HAVING GOOD DURABILITY ORIGIN ELECTRIC CO. LTD. (JP) 1997-06-18 EP disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0282634-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-09-21 EP disclosed
EP-0091131-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-07-20 EP disclosed
EP-0103305-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1987-07-22 EP disclosed
EP-0057018-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1985-06-05 EP disclosed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US disclosed
US-4479860-A ORGANOALUMINUM COMPOUND AND PEROXYSILYL COMPOUND AS HARDENING CATALYST TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-30 US disclosed
EP-0103305-A1 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1984-03-21 EP disclosed
EP-0091131-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1983-10-12 EP disclosed
US-4406764-A Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1983-09-27 US disclosed
EP-0057018-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1982-08-04 EP disclosed