SCHEMBL4956708

SCHEMBL4956708

CC=CC(=O)OCCCC(OCC)OCC

nearest known ligand 0.48

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.48
HCAR2 Q8TDS4 5/20 0.43
MAPT P10636 2/20 0.38
RAB9A P51151 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
TSHR P16473 2/20 0.38
HPGD P15428 1/20 0.38
GSTP1 P09211 1/20 0.35
APP P05067 5/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP3A4 P08684 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9717981 0.88 ATM (0.52) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL9139190 0.85 ATM (0.49) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL1970550 0.83 ATM (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL339523 0.83 ATM (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL4958416 0.82 ATM (0.47) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL4967684 0.80 ATM (0.48) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL4967675 0.80 ATM (0.48) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL20875236 0.79 ATM (0.60) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL20913247 0.79 ATM (0.60) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL8669692 0.79 ATM (0.60) ATMHCAR2MAPTRAB9ANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022004437-A1 CURABLE COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD, ELEMENT, AND DISPLAY DEVICE AGC株式会社 2022-01-06 WO disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021079819-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021075485-A1 GAP MATERIAL, ADHESIVE, AND DISPLAY DEVICE 積水化学工業株式会社 2021-04-22 WO disclosed
WO-2021075483-A1 OPTICAL BONDING PARTICLES, ADHESIVE, AND DISPLAY DEVICE 積水化学工業株式会社 2021-04-22 WO disclosed
WO-2020218317-A1 PARTICLE, AFFINITY PARTICLE, TEST REAGENT, AND DETECTION METHOD キヤノン株式会社 2020-10-29 WO disclosed
WO-2020121706-A1 GUARD COLUMN AND METHOD FOR PRODUCING GUARD COLUMN 昭和電工株式会社 2020-06-18 WO disclosed
WO-2019163743-A1 ACTINIC RAY-CURABLE ADHESIVE COMPOSITION, POLARIZATION FILM AND METHOD FOR MANUFACTURING SAME, OPTICAL FILM, AND IMAGE DISPLAY DEVICE 日東電工株式会社 2019-08-29 WO disclosed
US-20080203271-A1 METHOD OF MANUFACTURING A REPLICA MOLD AND A REPLICA MOLD RIKEN (JP) 2008-08-28 US disclosed
US-20080202163-A1 MATERIAL FOR HIGH REFRACTIVE INDEX GLASS, HIGH REFRACTIVE INDEX GLASS OBTAINED FROM THE MATERIAL, AND METHOD OF PATTERNING HIGH REFRACTIVE INDEX GLASS RIKEN (JP) 2008-08-28 US disclosed
US-20080203620-A1 METHOD OF FORMING MINUTE PATTERN RIKEN (JP) 2008-08-28 US disclosed
US-6525130-B1 Polymerization of silicone in a surfactant medium OMNOVA SOLUTIONS INC. 2003-02-25 US disclosed