SCHEMBL49636

SCHEMBL49636

CC(C)(C)N[SiH2]NC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3124716 0.86
SCHEMBL90407 0.78
SCHEMBL11736858 0.70
SCHEMBL16405966 0.67
SCHEMBL21434292 0.67
SCHEMBL7559178 0.67
SCHEMBL17701118 0.67
SCHEMBL19275257 0.67
Tert-Butylamine SCHEMBL2231254 0.62
SCHEMBL8720892 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4702 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260136856-A1 METHOD AND SYSTEM FOR FORMING SILICON NITRIDE ON A SIDEWALL OF A FEATURE ASM IP HOLDING BV (NL) 2026-05-14 US claimed
US-12628578-B2 Substrate processing method ASM IP HOLDING B.V. (NL) 2026-05-12 US claimed
US-20260103796-A1 MULTILAYER COATINGS FOR REDUCED SURFACE METALS ON OXIDE FILMS ENTEGRIS INC (US) 2026-04-16 US claimed
US-12571094-B2 Method of processing substrate, substrate processing apparatus, and recording medium Kokusai Electric Corporation (JP) 2026-03-10 US claimed
US-20260052917-A1 METHOD FOR FORMING AN INSULATING LAYER PATTERN AND SEMICONDUCTOR DEVICE DONGJIN SEMICHEM CO LTD (KR) 2026-02-19 US claimed
US-12546000-B2 Substrate processing method ASM IP HOLDING B.V. (NL) 2026-02-10 US claimed
US-12550644-B2 Method and system for forming silicon nitride on a sidewall of a feature ASM IP HOLDING B.V. (NL) 2026-02-10 US claimed
US-20260035783-A1 SIN FILM EMBEDDING METHOD AND FILM FORMATION APPARATUS TOKYO ELECTRON LTD (JP) 2026-02-05 US claimed
US-12525451-B2 Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures ASM IP HOLDING B.V. (NL) 2026-01-13 US claimed
US-12518966-B2 Selective plasma enhanced atomic layer deposition VERSUM MATERIALS US, LLC (US) 2026-01-06 US claimed
US-6500772-B2 In the presence of plasma energy contacting the substrate with a reactive gas component comprising an alkylaminosilane INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-12-31 US claimed
US-6486015-B1 Low temperature carbon rich oxy-nitride for improved RIE selectivity INFINEON TECHNOLOGIES AG (DE) 2002-11-26 US claimed
US-20020127763-A1 Sidewall spacers and methods of making same INTEL CORPORATION 2002-09-12 US claimed
US-20020090835-A1 Methods and materials for depositing films on semiconductor substrates INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-07-11 US claimed
EP-0964441-B1 Deposition of silicon dioxide and silicon oxynitride using bis(tertiarybutylamino)silane AIR PROD & CHEM (US) 2002-05-02 EP claimed
EP-1199743-A2 Method of fabricating a stack consisting of a layer of Si3N4 topped by a layer of SiO2 on a semiconductor substrate TEXAS INSTRUMENTS DEUTSCHLAND GMBH (DE) 2002-04-24 EP claimed
EP-1152460-A2 Method of etching a contact by RIE using a low temperature carbon rich oxy-nitride layer for improving etching selectivity Infineon Technologies North America Corp. (US) 2001-11-07 EP claimed
US-6268299-B1 Variable stoichiometry silicon nitride barrier films for tunable etch selectivity and enhanced hyrogen permeability INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-07-31 US claimed
EP-0964441-A2 Deposition of silicon dioxide and silicon oxynitride using bis(tertiarybutylamino)silane AIR PRODUCTS AND CHEMICALS, INC. (US) 1999-12-15 EP claimed
US-5976991-A Deposition of silicon dioxide and silicon oxynitride using bis(tertiarybutylamino) silane AIR PRODUCTS AND CHEMICALS, INC. (US) 1999-11-02 US claimed