SCHEMBL49717

SCHEMBL49717

CC[CH]NC(N)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3037299 0.79
SCHEMBL9593326 0.77
SCHEMBL16716 0.74
SCHEMBL3030202 0.74
SCHEMBL20310159 0.72
SCHEMBL1750372 0.72
SCHEMBL3020276 0.71
SCHEMBL21779709 0.70
SCHEMBL3045321 0.70
SCHEMBL3374213 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4647675-A Rhodamine dyes BASF AKTIENGESELLSCHAFT (DE) 1987-03-03 US claimed
US-11982974-B2 Flexible printed material HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2024-05-14 US disclosed
US-11326067-B2 Labels HP INDIGO B.V. (NL) 2022-05-10 US disclosed
WO-2021011006-A1 FLEXIBLE PRINTED MATERIAL HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-01-21 WO disclosed
US-20210009823-A1 LABELS HP INDIGO B.V. (NL) 2021-01-14 US disclosed
EP-3541880-A1 LABELS HP Indigo B.V. (NL) 2019-09-25 EP disclosed
WO-2018192651-A1 LABELS HP INDIGO B.V. (NL) 2018-10-25 WO disclosed
US-8129467-B2 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2012-03-06 US disclosed
US-8013052-B2 Curable resin, production method thereof, epoxy resin composition, and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-09-06 US disclosed
US-20100215604-A1 Cosmetic Compositions with Chitosan and Silicone Elastomers HENKEL AG & CO. KGAA (DE) 2010-08-26 US disclosed
US-20090062460-A1 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-03-05 US disclosed
US-20090023855-A1 NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2009-01-22 US disclosed
US-RE30798-E BY REACTING 4-FLUORO-3-NITROANILINES WITH AMMONIA OR A PRIMARY OR SECONDARY AMINE CLAIROL INCORPORATED (US) 1981-11-17 US disclosed
US-4174370-A INHIBITING CORROSION PETROLITE CORPORATION (US) 1979-11-13 US disclosed
US-4085134-A ANTISCALING, CORROSION RESISTANCE, CHELATING AGENTS PETROLITE CORPORATION (US) 1978-04-18 US disclosed
US-3944612-A HAIR DYE INTERMEDIATES CLAIROL INCORPORATED (US) 1976-03-16 US disclosed