Ethylene

Ethylene

SCHEMBL4976164

C=C.N=C=O.N=C=O.N=C=O.[SiH4]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene SCHEMBL4973165 1.00
Ethylene SCHEMBL5329726 0.94
Ethylene SCHEMBL3338318 0.94
Ethylene SCHEMBL29021100 0.94
Ethylene SCHEMBL4579824 0.94
Ethylene SCHEMBL28446 0.94
Ethylene SCHEMBL1852094 0.94
Ethylene SCHEMBL675897 0.94
Ethylene SCHEMBL635893 0.94
Ethylene SCHEMBL5620013 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5153068-A Discoloration inhibition SEKISUI FINE CHEMICAL CO., LTD. (JP) 1992-10-06 US claimed
US-20170221388-A1 PASTING LABEL AND LAMINATED PRODUCT FUJI XEROX CO., LTD. (JP) 2017-08-03 US disclosed
US-9656500-B1 Image recording medium and method for preparing image recording medium FUJI XEROX CO., LTD. (JP) 2017-05-23 US disclosed
US-20170120654-A1 IMAGE RECORDING MEDIUM AND METHOD FOR PREPARING IMAGE RECORDING MEDIUM FUJI XEROX CO., LTD. (JP) 2017-05-04 US disclosed
US-20160190651-A1 NONAQUEOUS ELECTROLYTE BATTERY AND BATTERY PACK KABUSHIKI KAISHA TOSHIBA (JP) 2016-06-30 US disclosed
CN-102405266-B Bonding sheet HITACHI CHEMICAL CO LTD 2014-07-16 CN disclosed
CN-103429688-A Resin paste composition for bonding semiconductor element, and semiconductor device HITACHI CHEMICAL CO LTD 2013-12-04 CN disclosed
EP-1422522-B1 Column packing and process for production thereof SHISEIDO CO LTD (JP) 2013-10-30 EP disclosed
CN-103282454-A Adhesive composition and semiconductor device using same HITACHI CHEMICAL CO LTD 2013-09-04 CN disclosed
CN-101578344-B Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide using same, and optical device using same HITACHI CHEMICAL CO LTD 2013-07-10 CN disclosed
CN-101688104-A Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these HITACHI CHEMICAL CO LTD 2010-03-31 CN disclosed
CN-101578344-A Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide using same, and optical device using same HITACHI CHEMICAL CO LTD (JP) 2009-11-11 CN disclosed
CN-100473704-C Adhesive sheet, semiconductor device and method for manufacturing the same HITACHI CHEMICAL CO LTD (JP) 2009-04-01 CN disclosed
US-7329386-B2 Column packing material and method for producing the same SHISEIDO CO., LTD. (JP) 2008-02-12 US disclosed
CN-1916097-A Adhesive sheet and semiconductor device and process for producing the same HITACHI CHEMICAL CO LTD (JP) 2007-02-21 CN disclosed
CN-1633487-A Adhesive sheet, semiconductor device and method for manufacturing the same HITACHI CHEMICAL CO LTD (JP) 2005-06-29 CN disclosed
EP-1422522-A1 COLUMN PACKING AND PROCESS FOR PRODUCTION THEREOF Shiseido Co., Ltd. (JP) 2004-05-26 EP disclosed
US-20040043493-A1 Column packing material and method for production thereof SANYO FINE IRICA TECHNOLOGY CO., LTD. (JP) 2004-03-04 US disclosed
CN-1025740-C Fluorine-containing copolymer composition MITSUI PETROCHEMICAL IND (JP) 1994-08-24 CN disclosed
CN-1053249-A The fluorinated copolymer composition MITSUI PETROCHEMICAL IND (JP) 1991-07-24 CN disclosed