⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9475313 | 0.68 | — | — | |
| SCHEMBL9351078 | 0.67 | — | — | |
| SCHEMBL11418465 | 0.62 | — | — | |
| SCHEMBL11440846 | 0.62 | — | — | |
| SCHEMBL18233401 | 0.57 | — | — | |
| SCHEMBL9246124 | 0.55 | — | — | |
| SCHEMBL7554731 | 0.55 | — | — | |
| SCHEMBL3910477 | 0.53 | PPARG (0.31) | — | |
| SCHEMBL11451525 | 0.53 | CYP3A4 (0.31) | — | |
| SCHEMBL11439683 | 0.53 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080057742-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070040153-A1 | Film for anisotropic conductivity and electronic circuits and devices using the film | CHEIL INDUSTRIES, INC. (KR) | 2007-02-22 | — | — | US | disclosed |
| WO-2007021070-A1 | FILM FOR ANISOTROPIC CONDUCTIVITY AND ELECTRONIC CIRCUITS AND DEVICES USING THE FILM | CHEIL INDUSTRIES INC. (KR) | 2007-02-22 | — | — | WO | disclosed |
| US-20060014860-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |