Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGAM | O43451 | 2/20 | 0.57 |
| ▸ | GAA | P10253 | 2/20 | 0.57 |
| ▸ | SI | P14410 | 2/20 | 0.57 |
| ▸ | MGAM2 | Q2M2H8 | 2/20 | 0.57 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.47 |
| ▸ | TSHR | P16473 | 4/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.33 |
| ▸ | KDM6B | O15054 | 1/20 | 0.33 |
| ▸ | KDM5C | P41229 | 1/20 | 0.33 |
| ▸ | EGLN1 | Q9GZT9 | 1/20 | 0.33 |
| ▸ | PHF8 | Q9UPP1 | 1/20 | 0.33 |
| ▸ | KDM2A | Q9Y2K7 | 1/20 | 0.33 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL586203 | 0.97 | MGAM (0.60) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL28224529 | 0.97 | MGAM (0.60) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL15847228 | 0.97 | MGAM (0.60) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL9280063 | 0.97 | MGAM (0.60) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL25283117 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL2532133 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL17105598 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL17994176 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL22472179 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL5481698 | 0.94 | MGAM (0.57) | MGAMGAASIMGAM2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8563179-B2 | Nonaqueous secondary battery | SANYO ELECTRIC CO., LTD. (JP) | 2013-10-22 | — | — | US | claimed |
| EP-3530614-B1 | SPHERICAL BORON NITRIDE FINE POWDER, METHOD FOR MANUFACTURING SAME AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | DENKA COMPANY LTD (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-11732173-B2 | Surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin composition | DENKA COMPANY LIMITED (JP) | 2023-08-22 | — | — | US | disclosed |
| US-20220154059-A1 | BORON NITRIDE AGGREGATED PARTICLES, THERMAL CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATION MEMBER | DENKA COMPANY LIMITED (JP) | 2022-05-19 | — | — | US | disclosed |
| US-20220154060-A1 | SURFACE-TREATED AGGREGATED BORON NITRIDE POWDER, AGGREGATED BORON NITRIDE POWDER, AND THERMALLY CONDUCTIVE RESIN COMPOSITION | DENKA COMPANY LTD (JP) | 2022-05-19 | — | — | US | disclosed |
| EP-3524573-B1 | BORON NITRIDE AGGREGATED GRAIN, METHOD FOR PRODUCING SAME, AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | DENKA COMPANY LTD (JP) | 2022-05-04 | — | — | EP | disclosed |
| US-11268004-B2 | Boron nitride aggregated grain | DENKA COMPANY LIMITED (JP) | 2022-03-08 | — | — | US | disclosed |
| US-10752503-B2 | Spherical boron nitride fine powder, method for manufacturing same and thermally conductive resin composition using same | DENKA COMPANY LIMITED (JP) | 2020-08-25 | — | — | US | disclosed |
| US-20200048091-A1 | SPHERICAL BORON NITRIDE FINE POWDER, METHOD FOR MANUFACTURING SAME AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | DENKA COMPANY LIMITED (JP) | 2020-02-13 | — | — | US | disclosed |
| US-20200040245-A1 | BORON NITRIDE AGGREGATED GRAIN, METHOD FOR PRODUCING SAME, AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | DENKA COMPANY LIMITED (JP) | 2020-02-06 | — | — | US | disclosed |
| EP-3530614-A1 | SPHERICAL BORON NITRIDE FINE POWDER, METHOD FOR MANUFACTURING SAME AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | Denka Company Limited (JP) | 2019-08-28 | — | — | EP | disclosed |
| EP-3524573-A1 | BORON NITRIDE AGGREGATED GRAIN, METHOD FOR PRODUCING SAME, AND THERMALLY CONDUCTIVE RESIN COMPOSITION USING SAME | Denka Company Limited (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20170198149-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, LIQUID CRYSTAL DISPLAY DEVICE, QUANTUM DOT-CONTAINING POLYMERIZABLE COMPOSITION, AND MANUFACTURING METHOD OF WAVELENGTH CONVERSION MEMBER | FUJIFILM CORPORATION (JP) | 2017-07-13 | — | — | US | disclosed |
| US-7420005-B2 | Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern | DAI NIPPON PRINTING CO., LTD. (JP) | 2008-09-02 | — | — | US | disclosed |
| US-20030129385-A1 | Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed pattern transfer sheet, optical article, stamper and method of forming finely embossed pattern | DAI NIPPON PRINTING CO., LTD. (JP) | 2003-07-10 | — | — | US | disclosed |