Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2A6 | P11509 | 5/20 | 0.52 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 3/20 | 0.40 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.40 |
| ▸ | HPRT1 | P00492 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | CA9 | Q16790 | 1/20 | 0.38 |
| ▸ | CYP1B1 | Q16678 | 2/20 | 0.37 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.37 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.36 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.36 |
| ▸ | ERN1 | O75460 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1036724 | 0.84 | CYP2A6 (0.52) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL8416358 | 0.82 | CYP2A6 (0.50) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL2569228 | 0.82 | CYP2A6 (0.50) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| Silver SCHEMBL11723519 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| Lithium Ion SCHEMBL3702126 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL3696175 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL3702128 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL3713255 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| SCHEMBL3696173 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR | |
| Hydrochloric Acid SCHEMBL28079045 | 0.81 | CYP2A6 (0.48) | CYP2A6CYP1A2ALDH1A1HSD17B10TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111694215-B | Photoresist composition and method for forming photolithographic pattern | 常州强力先端电子材料有限公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-111694215-A | Photoresist composition and method for forming photolithographic pattern | 常州强力先端电子材料有限公司 | 2020-09-22 | — | — | CN | disclosed |
| US-8105763-B2 | Method of forming plated product using negative photoresist composition and photosensitive composition used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| US-7879525-B2 | A photoresist comprising a resin that undergoes a change in alkali solubility by an acid, an acid generating compound and a corrosion inhibitor, e.g. trimercapto-1,3,5-triazine; stabiliity prior to development; used in the manufacturing of connection terminals during the mounting of semiconductors | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| EP-2202579-A2 | Chemically amplified photoresist composition, photoresist laminated product, manufacturing method for photoresist composition, manufacturing method for photoresist pattern, and manufacturing method for connection element | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2010-06-30 | — | — | EP | disclosed |
| US-20080032242-A1 | Method of Forming Plated Product Using Negative Photoresist Composition and Photosensitive Composition Used Therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-02-07 | — | — | US | disclosed |
| US-20070275320-A1 | Chemically Amplified Photorestist Composition, Laminated Product, and Connection Element | HITACHI CONSTRUCTION MACHINERY CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| EP-1818722-A1 | CHEMICAL AMPLIFICATION PHOTORESIST COMPOSITION, PHOTORESIST LAYER LAMINATE, METHOD FOR PRODUCING PHOTORESIST COMPOSITION, METHOD FOR PRODUCING PHOTORESIST PATTERN AND METHOD FOR PRODUCING CONNECTING TERMINAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-08-15 | — | — | EP | disclosed |
| EP-1761823-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-03-14 | — | — | EP | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| US-6838229-B2 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| US-20030039921-A1 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-02-27 | — | — | US | disclosed |
| US-5955241-A | Chemical-amplification-type negative resist composition and method for forming negative resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-09-21 | — | — | US | disclosed |