SCHEMBL5002952

SCHEMBL5002952

CCO[Si](OCC)(C(C)(C)CC)C(C)(C)CC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.32
TDP1 Q9NUW8 2/20 0.32
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8852530 0.89
SCHEMBL2399265 0.77 TSHR (0.32) TSHRTDP1ALDH1A1
SCHEMBL104523 0.75
SCHEMBL301818 0.74 TSHR (0.30) TSHRTDP1
SCHEMBL9243242 0.74 TSHR (0.30) TSHRTDP1
SCHEMBL2907302 0.73 TSHR (0.38) TSHRTDP1ALDH1A1
SCHEMBL8852333 0.73
SCHEMBL301382 0.72
SCHEMBL301675 0.69
SCHEMBL8852332 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240199913-A1 METHOD FOR SUPPRESSING COLLAPSE OF THREE-DIMENSIONAL STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2024-06-20 US disclosed
EP-4309006-A1 METHOD FOR SUPPRESSING COLLAPSE OF THREE-DIMENSIONAL STRUCTURE Tokyo Ohka Kogyo Co., Ltd. (JP) 2024-01-24 EP disclosed
WO-2022213043-A1 METHOD FOR SUPPRESSING COLLAPSE OF THREE-DIMENSIONAL STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2022-10-06 WO disclosed
US-7413775-B2 Insulating film material containing an organic silane compound, its production method and semiconductor device TOSOH CORPORATION (JP) 2008-08-19 US disclosed
US-7160625-B2 Insulating film material containing an organic silane compound, its production method and semiconductor device TOSOH CORPORATION (JP) 2007-01-09 US disclosed
US-20060127683-A1 Insulating film material containing an organic silane compound, its production method and semiconductor device TOSOH CORPORATION 2006-06-15 US disclosed
US-20030180550-A1 Insulating film material containing an organic silane compound, its production method and semiconductor device TOSOH CORPORATION 2003-09-25 US disclosed
US-5594079-A COORDINATION CATALYST CONTAINING BORON, STEREOREGULAR POLYPROPYLENE TOSOH CORPORATION (JP) 1997-01-14 US disclosed
EP-0475134-B1 Method for producing a stereospecific polyolefin TOSOH CORP (JP) 1996-11-06 EP disclosed
EP-0504744-B1 Method for producing a stereospecific polyolefin TOSOH CORP (JP) 1996-07-17 EP disclosed
US-5489634-A EFFICIENT SELECTIVE CATALYTIC POLYMERIZATION OF ALPHA-OLEFINS YIELDS HIGH MOLECULAR WEIGHT SPHERICAL PARTICLES HAVING HIGH BULK DENSITY, CONTROLLED PARTICLE SIZE AND MOLECULAR WEIGHT DISTRIBUTION TOSOH CORPORATION (JP) 1996-02-06 US disclosed
EP-0582278-A2 Method for producing a polyolefin TOSOH CORPORATION (JP) 1994-02-09 EP disclosed
US-5244989-A METHOD FOR PRODUCING A STEREOSPECIFIC POLYOLEFIN TOSOH CORPORATION (JP) 1993-09-14 US disclosed
EP-0530814-A1 Method for producing a stereospecific polyolefin TOSOH CORPORATION (JP) 1993-03-10 EP disclosed
EP-0504744-A2 Method for producing a stereospecific polyolefin TOSOH CORPORATION (JP) 1992-09-23 EP disclosed
EP-0475134-A2 Method for producing a stereospecific polyolefin Tosoh Corporation (JP) 1992-03-18 EP disclosed