⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30960179 | 1.00 | — | — | |
| SCHEMBL29371030 | 1.00 | — | — | |
| Zinc Ion SCHEMBL29383064 | 0.87 | — | — | |
| SCHEMBL31718812 | 0.87 | — | — | |
| SCHEMBL29521057 | 0.87 | — | — | |
| SCHEMBL23610355 | 0.87 | — | — | |
| SCHEMBL16348626 | 0.87 | — | — | |
| SCHEMBL18978706 | 0.87 | — | — | |
| SCHEMBL15400219 | 0.87 | — | — | |
| Zinc Ion SCHEMBL15477433 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 3273 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026104903-A1 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社半導体エネルギー研究所 | 2026-05-21 | — | — | WO | claimed |
| US-12628460-B2 | Photoelectric conversion element and method for manufacturing photoelectric conversion element | IDEMITSU KOSAN CO., LTD. (JP) | 2026-05-12 | — | — | US | claimed |
| US-20260005256-A1 | PRESSURE INDUCED TRANSITION MATERIALS FOR IMPROVED ELECTRODE SAFETY AND PERFORMANCE | AMERICAN LITHIUM ENERGY CORPORATION (US) | 2026-01-01 | — | — | US | claimed |
| US-12472495-B2 | Microfluidic device for live cell manipulation and analysis | NORTHWESTERN UNIVERSITY (US) | 2025-11-18 | — | — | US | claimed |
| EP-4613480-A1 | PROCESS FOR FUNCTIONALIZATION OF POLYVINYL ACETAL FILMS ON A POLYMER CARRIER | Kuraray Europe GmbH (DE) | 2025-09-10 | — | — | EP | claimed |
| EP-4613479-A1 | POLYVINYL ACETAL FILMS WITH FUNCTIONALIZATION | Kuraray Europe GmbH (DE) | 2025-09-10 | — | — | EP | claimed |
| US-20250138226-A1 | IMAGE CAPTURING SYSTEM WITH WAVELENGTH-SELECTIVE ENERGY SCATTERING LAYER | FACE INTERNATIONAL CORPORATION (US) | 2025-05-01 | — | — | US | claimed |
| CN-119562662-A | TOPCon battery film layer structure and preparation method thereof | 江苏润达新能源科技有限公司 | 2025-03-04 | — | — | CN | claimed |
| CN-119562600-A | TOPCon battery with transparent conductive layer and preparation method thereof | 江苏润达新能源科技有限公司 | 2025-03-04 | — | — | CN | claimed |
| US-20250030220-A1 | SEMICONDUCTOR LASER ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) | 2025-01-23 | — | — | US | claimed |
| US-20010002066-A1 | Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same | HITACHI CABLE LTD. (JP) | 2001-05-31 | — | — | US | claimed |
| US-6221751-B1 | Wafer fabrication of die-bottom contacts for electronic devices | CHIPSCALE, INC. | 2001-04-24 | — | — | US | claimed |
| US-6218774-B1 | Photoluminescent/electroluminescent display screen | POPE EDWARD J A (US) | 2001-04-17 | — | — | US | claimed |
| US-6178274-B1 | Image reading apparatus and method for preventing electric noise | RICOH COMPANY, LTD. (JP) | 2001-01-23 | — | — | US | claimed |
| WO-2000017863-A1 | MAGNETORESISTIVE DEVICES, GIANT MAGNETORESISTIVE DEVICES AND METHODS FOR MAKING SAME | MATERIALS INNOVATION, INC. (US) | 2000-03-30 | — | — | WO | claimed |
| US-5910687-A | Wafer fabrication of die-bottom contacts for electronic devices | CHIPSCALE, INC. (US) | 1999-06-08 | — | — | US | claimed |
| US-5904496-A | Wafer fabrication of inside-wrapped contacts for electronic devices | CHIPSCALE, INC. (US) | 1999-05-18 | — | — | US | claimed |
| WO-1998033214-A1 | SEMICONDUCTOR WAFER FABRICATION OF INSIDE-WRAPPED CONTACTS FOR ELECTRONIC DEVICES | CHIPSCALE, INC. (US) | 1998-07-30 | — | — | WO | claimed |
| WO-1998033215-A1 | SEMICONDUCTOR WAFER FABRICATION OF DIE-BOTTOM CONTACTS FOR ELECTRONIC DEVICES | CHIPSCALE, INC. (US) | 1998-07-30 | — | — | WO | claimed |
| US-5546413-A | Integrated light emitting device | MOTOROLA (US) | 1996-08-13 | — | — | US | claimed |