SCHEMBL5013210

SCHEMBL5013210

O=C([O-])CCCC1CCCCC1.O=C([O-])CCCC1CCCCC1.O=C([O-])CCCC1CCCCC1.O=C([O-])CCCC1CCCCC1.[Pb+4]

nearest known ligand 0.47

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.45
HPGD P15428 1/20 0.44
KDM5A P29375 3/20 0.42
PHF8 Q9UPP1 3/20 0.42
KDM2A Q9Y2K7 3/20 0.42
KDM4C Q9H3R0 2/20 0.42
KDM4A O75164 1/20 0.42
SIGMAR1 Q99720 1/20 0.42
BBOX1 O75936 2/20 0.42
EPHX1 P07099 1/20 0.41
P2RX7 Q99572 1/20 0.40
NAAA Q02083 1/20 0.40
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7159891 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL6435948 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL2525738 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL15263567 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL6436051 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
Potassium Ion SCHEMBL3886712 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL7513286 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL22598033 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL22418773 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A
SCHEMBL7095687 0.96 CYP1A2 (0.45) CYP1A2HPGDKDM5APHF8KDM2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-63017925-A None JP disclosed
WO-2025089072-A1 POLYACETAL RESIN COMPOSITION ポリプラスチックス株式会社 2025-05-01 WO disclosed
CN-118055975-B Polyacetal resin composition 宝理塑料株式会社 2025-03-07 CN disclosed
CN-118055975-A Polyacetal resin composition 宝理塑料株式会社 2024-05-17 CN disclosed
US-20080020133-A1 Method of Producing Metal Oxide Film DAI NIPPON PRINTING CO., LTD. (JP) 2008-01-24 US disclosed
US-20070298190-A1 Method of Producing Metal Oxide Film DAI NIPPON PRINTING CO., LTD. (JP) 2007-12-27 US disclosed
US-20060219294-A1 Oxide semiconductor electrode, dye-sensitized solar cell, and, method of producing the same DAI NIPPON PRINTING CO., LTD. 2006-10-05 US disclosed
US-20050183769-A1 Method of producing substrate for dye-sensitized solar cell and dye-sensitized solar cell DAI NIPPON PRINTING CO., LTD. (JP) 2005-08-25 US disclosed
US-5958815-A HYDROLYTIC CONDENSATION OF: CHELATING POLAR SOLVENT, LEAD CARBOXYLATES, TITANIUM AND/OR ZIRCONIUM TETRAALKOXIDES; AGING BEYOND GEL POINT, REPLACING SOLVENT WITH LOW POLARITY NONCHELATING SOLVENT, SUPERCRITICAL DRYING, TEMPERING AEROGEL FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) 1999-09-28 US disclosed
US-5204313-A Forming precursor containing bismuth, lead, copper, calcium, strontium on substrate surface of silver, gold or platinum group metal, heating EASTMAN KODAK COMPANY (US) 1993-04-20 US disclosed
EP-0397499-A1 Silicon.containing polymers based on polybutene intermediate products and process for the manufacture of these polymers and intermediate products BP Chemicals Limited (GB) 1990-11-14 EP disclosed
JP-S6317925-A EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING SUMITOMO BAKELITE CO LTD 1988-01-25 JP disclosed
US-4524187-A HYDROSILATION ANIC S.P.A. (IT) 1985-06-18 US disclosed