⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28394318 | 0.89 | — | — | |
| SCHEMBL31156729 | 0.89 | — | — | |
| SCHEMBL29124169 | 0.89 | — | — | |
| SCHEMBL1509156 | 0.87 | — | — | |
| SCHEMBL28162794 | 0.87 | — | — | |
| SCHEMBL544863 | 0.87 | — | — | |
| SCHEMBL29203047 | 0.87 | — | — | |
| SCHEMBL9535967 | 0.87 | — | — | |
| SCHEMBL578578 | 0.87 | — | — | |
| SCHEMBL15168920 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120060719-A | Nickel titanium copper vanadium shape memory alloy with wide temperature range and preparation method thereof | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 2025-05-30 | — | — | CN | claimed |
| CN-118623700-A | Heat abstractor and equipment based on shape memory alloy | 深圳制熵创新科技有限公司 | 2024-09-10 | — | — | CN | claimed |
| CN-118555798-A | Thermoelastic heat dissipation device and equipment based on shape memory alloy | 深圳制熵创新科技有限公司 | 2024-08-27 | — | — | CN | claimed |
| CN-102487049-B | Semiconductor substrate and method for manufacturing the same | SILICONWARE PRECISION INDUSTRIES CO.,LTD. (CN) | 2014-10-15 | — | — | CN | claimed |
| CN-103258809-A | Copper metal connecting wire of III-V compound semiconductor assembly | WIN SEMICONDUCTORS CORP | 2013-08-21 | — | — | CN | claimed |
| CN-102487049-A | Semiconductor substrate and method for manufacturing the same | SILICONWARE PRECISION INDUSTRIES CO LTD | 2012-06-06 | — | — | CN | claimed |
| CN-102339767-A | Semiconductor device and method for manufacturing the same | SILICONWARE PRECISION INDUSTRIES CO LTD | 2012-02-01 | — | — | CN | claimed |
| US-20080283971-A1 | Semiconductor Device and Its Fabrication Method | SILICONWARE PRECISION INDUSTRIES CO., LTD. (TW) | 2008-11-20 | — | — | US | claimed |
| CN-101290894-A | Semiconductor device and method for fabricating the same | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-10-22 | — | — | CN | claimed |
| CN-101286459-A | Stackable semiconductor device and method for fabricating the same | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-10-15 | — | — | CN | claimed |
| CN-101261944-A | Sensing type semiconductor package and manufacturing method thereof | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-09-10 | — | — | CN | claimed |
| CN-101261942-A | Sensing type semiconductor device and manufacturing method thereof | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-09-10 | — | — | CN | claimed |
| US-20080203511-A1 | Sensor-type semiconductor package and method for fabricating the same | SILICONWARE PRECISION INDUSTRIES CO., LTD. (TW) | 2008-08-28 | — | — | US | claimed |
| CN-101241864-A | Sensing type semiconductor package and manufacturing method thereof | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-08-13 | — | — | CN | claimed |
| CN-120060719-A | Nickel titanium copper vanadium shape memory alloy with wide temperature range and preparation method thereof | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 2025-05-30 | — | — | CN | disclosed |
| CN-120060719-A | Nickel titanium copper vanadium shape memory alloy with wide temperature range and preparation method thereof | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 2025-05-30 | — | — | CN | disclosed |
| CN-120060719-A | Nickel titanium copper vanadium shape memory alloy with wide temperature range and preparation method thereof | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 2025-05-30 | — | — | CN | disclosed |
| US-20080203511-A1 | Sensor-type semiconductor package and method for fabricating the same | SILICONWARE PRECISION INDUSTRIES CO., LTD. (TW) | 2008-08-28 | — | — | US | disclosed |
| CN-101241864-A | Sensing type semiconductor package and manufacturing method thereof | SILICONWARE PRECISION INDUSTRIES CO LTD (CN) | 2008-08-13 | — | — | CN | disclosed |
| CN-101110377-A | Method for forming welding projection | ADVANCED SEMICONDUCTOR ENG (CN) | 2008-01-23 | — | — | CN | disclosed |