SCHEMBL5037296

SCHEMBL5037296

CCC1(O)CCCCC1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19863564 0.93
SCHEMBL19857393 0.93
SCHEMBL25069819 0.84
SCHEMBL8117459 0.83
SCHEMBL8120196 0.79 SLC6A4 (0.35)
SCHEMBL8114073 0.77
SCHEMBL15543814 0.77
SCHEMBL8109789 0.76 DPP4 (0.33)
SCHEMBL8118846 0.76 DPP4 (0.36)
SCHEMBL17835268 0.76 MAPT (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3150617-A1 ANTIBACTERIAL AMINOGLYCOSIDE ANALOGS Achaogen, Inc. (US) 2017-04-05 EP disclosed
WO-2008139941-A1 SUBSTITUTED IMIDAZOLE COMPOUND AND USE THEREOF TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2008-11-20 WO disclosed
EP-1450796-B1 BENZOTHIAZOLE DERIVATIVES HOFFMANN LA ROCHE (CH) 2008-04-09 EP disclosed
US-7067571-B2 Antistatic agent and resin composition and formed product SATO LEGAL REPRESENTATIVE HIRO 2006-06-27 US disclosed
US-7025070-B2 Resin composition for purging contaminant in the plastic processing machine SATO SHIGEKATU 2006-04-11 US disclosed
US-6946026-B2 Release agent for metallic mold SATO HIROAKI 2005-09-20 US disclosed
US-20040132878-A1 Resin composition for purging contaminant in the plastic processing machine SATO SHIGEKATU (JP) 2004-07-08 US disclosed
US-20040132879-A1 Antistatic agent and resin composition and formed product SATO SHIGEKATU (JP) 2004-07-08 US disclosed
US-20040083925-A1 Release agent for metallic mold SATO SHIGEKATU (JP) 2004-05-06 US disclosed