⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1628671 | 0.87 | — | — | |
| SCHEMBL30732922 | 0.82 | — | — | |
| SCHEMBL30713445 | 0.82 | — | — | |
| SCHEMBL29351828 | 0.82 | — | — | |
| SCHEMBL29466872 | 0.82 | — | — | |
| SCHEMBL29352049 | 0.82 | — | — | |
| SCHEMBL431622 | 0.67 | — | — | |
| SCHEMBL3991765 | 0.67 | — | — | |
| SCHEMBL8386430 | 0.67 | — | — | |
| SCHEMBL6848334 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1317763-B1 | FUSE LINK, METHOD FOR THE PRODUCTION THEREOF AND SOLDERING SUBSTANCE | SIEMENS AG (DE) | 2008-05-14 | — | — | EP | claimed |
| US-20040027226-A1 | Fuse link, method for the production thereof and soldering substance | SIEMENS AKTIENGESELLSCHAFT (DE) | 2004-02-12 | — | — | US | claimed |
| US-20250300146-A1 | Extremely Large Area Integrated Circuit | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2025-09-25 | — | — | US | disclosed |
| US-20250159983-A1 | Active Wafer-Scale Reconfigurable Logic Fabric for AI and High-Performance Embedded Computing | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2025-05-15 | — | — | US | disclosed |
| WO-2023229701-A1 | EXTREMELY LARGE AREA INTEGRATED CIRCUIT | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2023-11-30 | — | — | WO | disclosed |
| US-7109839-B2 | Fuse link, method for the production thereof and soldering substance | SIEMENS AKTIENGESELLSCHAFT (DE) | 2006-09-19 | — | — | US | disclosed |
| US-20040027226-A1 | Fuse link, method for the production thereof and soldering substance | SIEMENS AKTIENGESELLSCHAFT (DE) | 2004-02-12 | — | — | US | disclosed |
| EP-1189252-A1 | Fuse link, method of manufacturing the same and solder material | SIEMENS AKTIENGESELLSCHAFT (DE) | 2002-03-20 | — | — | EP | disclosed |