SCHEMBL5038436

SCHEMBL5038436

[BiH3].[Fe].[SnH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1628674 0.87
SCHEMBL235566 0.82
SCHEMBL4697257 0.82
SCHEMBL11777278 0.82
SCHEMBL23928064 0.67
SCHEMBL8386433 0.67
SCHEMBL21817048 0.67
SCHEMBL21056417 0.67
SCHEMBL9839567 0.67
SCHEMBL2861983 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1317763-B1 FUSE LINK, METHOD FOR THE PRODUCTION THEREOF AND SOLDERING SUBSTANCE SIEMENS AG (DE) 2008-05-14 EP claimed
US-20040027226-A1 Fuse link, method for the production thereof and soldering substance SIEMENS AKTIENGESELLSCHAFT (DE) 2004-02-12 US claimed
US-7109839-B2 Fuse link, method for the production thereof and soldering substance SIEMENS AKTIENGESELLSCHAFT (DE) 2006-09-19 US disclosed
US-20040027226-A1 Fuse link, method for the production thereof and soldering substance SIEMENS AKTIENGESELLSCHAFT (DE) 2004-02-12 US disclosed
EP-1189252-A1 Fuse link, method of manufacturing the same and solder material SIEMENS AKTIENGESELLSCHAFT (DE) 2002-03-20 EP disclosed