SCHEMBL5044721

SCHEMBL5044721

O=C(O)c1cccc(Oc2cccc(-c3ccc(Oc4cccc(C(=O)O)c4)c(-c4ccccc4)c3)c2)c1

nearest known ligand 0.62

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ AKR1C3 P42330 1/20 0.62
▸ MRGPRX4 Q96LA9 2/20 0.53
▸ KMO O15229 2/20 0.50
▸ NR4A2 P43354 1/20 0.49
▸ TTR P02766 2/20 0.49
▸ PRKAG1 P54619 1/20 0.47
▸ PRKAA2 P54646 1/20 0.47
▸ PRKAB1 Q9Y478 1/20 0.47
▸ PPARG P37231 1/20 0.47
▸ PPARD Q03181 1/20 0.47
▸ PPARA Q07869 1/20 0.47
▸ FABP1 P07148 2/20 0.47
▸ KDM4E B2RXH2 1/20 0.47
▸ LMNA P02545 1/20 0.46
▸ GAA P10253 1/20 0.46
▸ RXRA P19793 1/20 0.46
▸ RXRB P28702 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30307444 1.00 AKR1C3 (0.62) AKR1C3MRGPRX4KMONR4A2TTR
SCHEMBL5048542 0.95 AKR1C3 (0.63) AKR1C3MRGPRX4KMONR4A2TTR
SCHEMBL29963819 0.90 SRD5A2 (0.53) AKR1C3TTRPPARGPPARDPPARA
SCHEMBL5042761 0.90 SRD5A2 (0.53) AKR1C3TTRPPARGPPARDPPARA
SCHEMBL29964068 0.90 AKR1C3 (0.64) AKR1C3MRGPRX4KMONR4A2PRKAG1
SCHEMBL5043190 0.90 AKR1C3 (0.64) AKR1C3MRGPRX4KMONR4A2PRKAG1
SCHEMBL21179470 0.86 AKR1C3 (0.61) AKR1C3MRGPRX4KMONR4A2TTR
SCHEMBL21179471 0.86 AKR1C3 (0.61) AKR1C3MRGPRX4KMONR4A2TTR
SCHEMBL5042777 0.85 AKR1C3 (0.79) AKR1C3MRGPRX4KMONR4A2FABP1
SCHEMBL11820028 0.84 GSTP1 (0.49) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022211086-A1 POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2022-10-06 — — WO disclosed
US-20210246268-A1 SILICON-CONTAINING COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-12 — — US disclosed
EP-3786213-A1 SILICON-CONTAINING COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2021-03-03 — — EP disclosed
US-20190352463-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-11-21 — — US disclosed
US-20170165879-A1 RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-06-15 — — US disclosed
US-7416822-B2 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2008-08-26 — — US disclosed
US-20070154843-A1 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-07-05 — — US disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 — — EP disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 — — EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 — — US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 — — US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 — — EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 — — EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 — — US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 — — US disclosed
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