SCHEMBL5069268

SCHEMBL5069268

O=C(/C=C\C(=O)OC1=CCCC1)OC1=CCCC1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GSTP1 P09211 1/20 0.39
HDAC4 P56524 2/20 0.35
HDAC2 Q92769 2/20 0.35
HDAC8 Q9BY41 2/20 0.35
HDAC6 Q9UBN7 2/20 0.35
HDAC3 O15379 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC7 Q8WUI4 1/20 0.35
HDAC5 Q9UQL6 1/20 0.35
KDM4E B2RXH2 1/20 0.32
MAPT P10636 1/20 0.32
HPGD P15428 1/20 0.32
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5066946 1.00 GSTP1 (0.39) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL5917768 1.00 GSTP1 (0.39) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL22092284 0.94 HDAC4 (0.37) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL4163887 0.93 TAAR1 (0.38) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL4163882 0.93 TAAR1 (0.38) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL4166371 0.93 TAAR1 (0.38) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL22092286 0.92 HDAC4 (0.36) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL22092285 0.92 HDAC4 (0.36) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL2134011 0.87 TAAR1 (0.43) GSTP1HDAC4HDAC2HDAC8HDAC6
SCHEMBL2134018 0.87 TAAR1 (0.43) GSTP1HDAC4HDAC2HDAC8HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8169921-A None JP disclosed
CN-117836927-A Resin cured film, semiconductor device, and method for manufacturing semiconductor device 株式会社力森诺科 2024-04-05 CN disclosed
EP-3750928-B1 ACRYLIC COPOLYMER, PREPARATION METHOD THEREFOR, AND ACRYLIC COPOLYMER COMPOSITION COMPRISING SAME LG CHEMICAL LTD (KR) 2024-02-21 EP disclosed
CN-117280447-A Photosensitive resin composition selection method, pattern cured film production method, cured film, semiconductor device, and semiconductor device production method 株式会社力森诺科 2023-12-22 CN disclosed
US-20230104391-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2023-04-06 US disclosed
WO-2022239232-A1 METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-11-17 WO disclosed
WO-2021071085-A1 ACRYLIC COPOLYMER, METHOD FOR MANUFACTURING SAME, AND ACRYLIC COPOLYMER COMPOSITION COMPRISING SAME 주식회사 엘지화학 2021-04-15 WO disclosed
WO-2021071093-A1 ACRYLIC COPOLYMER COMPOSITION, METHOD FOR MANUFACTURING SAME, AND ACRYLIC COPOLYMER BLEND COMPRISING SAME 주식회사 엘지화학 2021-04-15 WO disclosed
US-20210002401-A1 Acrylic Copolymer, Method of Preparing the Same, and Acrylic Copolymer Composition Including the Same LG CHEM, LTD. (KR) 2021-01-07 US disclosed
EP-3750928-A1 ACRYLIC COPOLYMER, PREPARATION METHOD THEREFOR, AND ACRYLIC COPOLYMER COMPOSITION COMPRISING SAME LG CHEM, LTD. (KR) 2020-12-16 EP disclosed
EP-1302507-B1 Thermoplastic elastomer composition, moldings using the same JSR CORP (JP) 2006-12-27 EP disclosed
US-6815506-B2 DYNAMICALLY CROSSLINKED MIXTURE OF OLEFIN RESIN; UNSATURATED ACRYLIC RUBBER FROM DIUNSATURATED MONOMER, ALKYL OR ALKOXYALKYL ACRYLATE, AND ACRYLONITRILE; AND INORGANIC FILLER JSR CORPORATION (JP) 2004-11-09 US disclosed
US-20030096071-A1 Oil-resistant thermoplastic elastomer composition and moldings using the same JSR CORPORATION (JP) 2003-05-22 US disclosed
CN-1412231-A Oil-proof thermoplastic elastic body composition and moulded goods using said composition JSR CORP (JP) 2003-04-23 CN disclosed
EP-1302507-A2 Thermoplastic elastomer composition, moldings using the same JSR Corporation (JP) 2003-04-16 EP disclosed
US-6476094-B1 Compositions containing unsaturated polyester resins and their use for the production of coatings BAYER AKTIENGESELLSCHAFT (DE) 2002-11-05 US disclosed
JP-H08169921-A PHOTOCURABLE RESIN COMPOSITION HITACHI CHEM CO LTD 1996-07-02 JP disclosed
EP-0166449-A2 Low viscosity polyester compositions and a process for the preparation thereof UNION CARBIDE CORPORATION (US) 1986-01-02 EP disclosed
US-4532297-A Contacting maleic acid or anhydride with polyol to form ester, heating to form fumarate ester, reacting with Diels-Alder adduct of cyclopentadiene and unsaturated hydrocarbon to form ester, adding unsaturated monomer UNION CARBIDE CORPORATION (US) 1985-07-30 US disclosed
US-4522978-A MOLDING MATERIALS, COATINGS, SEALS AND ADHESIVES UNION CARBIDE CORPORATION (US) 1985-06-11 US disclosed