SCHEMBL5075941

SCHEMBL5075941

Cc1ccc(Cl)cc1Cl.[Na]

nearest known ligand 0.54

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 5/20 0.54
TP53 P04637 2/20 0.52
FLT1 P17948 1/20 0.49
FLT4 P35916 1/20 0.49
KDR P35968 1/20 0.49
TSHR P16473 4/20 0.46
HSD17B10 Q99714 2/20 0.46
HSD11B1 P28845 1/20 0.43
LMNA P02545 1/20 0.43
HTT P42858 1/20 0.43
TDP1 Q9NUW8 3/20 0.42
MAPK1 P28482 1/20 0.42
HTR2A P28223 1/20 0.42
SLC6A4 P31645 1/20 0.42
KCNH2 Q12809 1/20 0.42
RAPGEF4 Q8WZA2 3/20 0.42
IDO1 P14902 1/20 0.41
ALDH1A1 P00352 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29351078 0.97
SCHEMBL28352 0.97
Hydrochloric Acid SCHEMBL11827454 0.94 CYP3A4 (0.54) CYP3A4TP53FLT1FLT4KDR
Ammonia Solution, Strong SCHEMBL1642091 0.94 CYP3A4 (0.54) CYP3A4TP53FLT1FLT4KDR
SCHEMBL5422262 0.87 CYP3A4 (0.48) CYP3A4TP53FLT1FLT4KDR
SCHEMBL788090 0.85 FLT1 (0.51) CYP3A4TP53FLT1FLT4KDR
SCHEMBL8024442 0.84 CYP3A4 (0.45) CYP3A4TP53FLT1FLT4KDR
SCHEMBL10788935 0.82 FLT1 (0.53) CYP3A4TP53FLT1FLT4KDR
SCHEMBL5617689 0.79 CYP3A4 (0.41) CYP3A4TP53FLT1FLT4KDR
SCHEMBL17601988 0.79 SMN1; SMN2 (0.47) CYP3A4TP53FLT1FLT4KDR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1497374-B1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GEN ELECTRIC (US) 2008-08-13 EP disclosed
CN-1314761-C Filler reinforced polyether imide resin composition and molded article thereof GEN ELECTRIC (US) 2007-05-09 CN disclosed
CN-1659234-A filler-reinforced polyetherimide resin composition and molded article thereof GEN ELECTRIC (US) 2005-08-24 CN disclosed
EP-1497374-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
WO-2003087226-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPAMY (US) 2003-10-23 WO disclosed