⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL38665630 | 1.00 | — | — | |
| SCHEMBL28195744 | 0.87 | — | — | |
| SCHEMBL28304503 | 0.87 | — | — | |
| SCHEMBL28114986 | 0.87 | — | — | |
| SCHEMBL3775995 | 0.87 | — | — | |
| SCHEMBL28177565 | 0.87 | — | — | |
| SCHEMBL28085483 | 0.87 | — | — | |
| SCHEMBL3779135 | 0.87 | — | — | |
| SCHEMBL3775307 | 0.87 | — | — | |
| SCHEMBL2035814 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-222071946-U | Multi-channel high-voltage transistor integrated circuit module packaging structure | 中国振华集团永光电子有限公司（国营第八七三厂） | 2024-11-26 | — | — | CN | claimed |
| CN-117747610-A | Multi-channel high-voltage transistor circuit module packaging method and packaging structure thereof | 中国振华集团永光电子有限公司（国营第八七三厂） | 2024-03-22 | — | — | CN | claimed |
| CN-117403293-A | Preparation method of nickel-cobalt-gold alloy coating on surface of conducting ring | 武汉半边天医疗技术发展有限公司 | 2024-01-16 | — | — | CN | claimed |
| CN-109706500-A | Porous aluminium oxide loaded cobalt-nickel alloy nano wire is used as the preparation method of electrochemistry evolving hydrogen reaction catalyst | 西南大学 | 2019-05-03 | — | — | CN | claimed |
| CN-222071946-U | Multi-channel high-voltage transistor integrated circuit module packaging structure | 中国振华集团永光电子有限公司（国营第八七三厂） | 2024-11-26 | — | — | CN | disclosed |
| CN-117747610-A | Multi-channel high-voltage transistor circuit module packaging method and packaging structure thereof | 中国振华集团永光电子有限公司（国营第八七三厂） | 2024-03-22 | — | — | CN | disclosed |
| CN-117403293-A | Preparation method of nickel-cobalt-gold alloy coating on surface of conducting ring | 武汉半边天医疗技术发展有限公司 | 2024-01-16 | — | — | CN | disclosed |
| CN-117403293-A | Preparation method of nickel-cobalt-gold alloy coating on surface of conducting ring | 武汉半边天医疗技术发展有限公司 | 2024-01-16 | — | — | CN | disclosed |
| CN-117403293-A | Preparation method of nickel-cobalt-gold alloy coating on surface of conducting ring | 武汉半边天医疗技术发展有限公司 | 2024-01-16 | — | — | CN | disclosed |
| CN-218958685-U | Sealing conductive structure of oil-immersed high-power motor | 新乡航空工业(集团)有限公司 | 2023-05-02 | — | — | CN | disclosed |
| CN-108622943-B | A method of with useless nickel cobalt (alloy) production LITHIUM BATTERY nickel sulfate and cobaltous sulfate | 河海大学 | 2019-11-05 | — | — | CN | disclosed |
| CN-209420849-U | A kind of fig deep processing beverage production system | 太原市维盛农业技术开发有限公司 | 2019-09-24 | — | — | CN | disclosed |
| CN-106449127-A | Low-temperature synthesis method of chloride-ion-intercalated 3D nickel-cobalt double-metal-hydroxide material | 河北工业大学 | 2017-02-22 | — | — | CN | disclosed |
| CN-101553918-B | Semiconductor structure and assembly method | FREESCALE SEMICONDUCTOR INC | 2011-09-07 | — | — | CN | disclosed |
| CN-101553918-A | Semiconductor structure and assembly method | FREESCALE SEMICONDUCTOR INC (US) | 2009-10-07 | — | — | CN | disclosed |
| US-7446411-B2 | Semiconductor structure and method of assembly | FREESCALE SEMICONDUCTOR, INC. (US) | 2008-11-04 | — | — | US | disclosed |
| US-7429790-B2 | Semiconductor structure and method of manufacture | FREESCALE SEMICONDUCTOR, INC. (US) | 2008-09-30 | — | — | US | disclosed |
| WO-2007050287-A2 | SEMICONDUCTOR STRUCTURE AND METHOD OF ASSEMBLY | FREESCALE SEMICONDUCTOR, INC. (US) | 2007-05-03 | — | — | WO | disclosed |
| US-20070090515-A1 | Semiconductor structure and method of assembly | FREESCALE SEMICONDUCTOR, INC. | 2007-04-26 | — | — | US | disclosed |
| US-20070090514-A1 | Semiconductor structure and method of manufacture | FREESCALE SEMICONDUCTOR, INC. | 2007-04-26 | — | — | US | disclosed |