SCHEMBL5077784

SCHEMBL5077784

C=C(C)O[Si](C)(OC(=C)C)OC(C)=CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6055358 0.87
SCHEMBL6055357 0.87
SCHEMBL204621 0.84 HSD17B10 (0.33)
SCHEMBL450653 0.74
SCHEMBL7628277 0.73
SCHEMBL10358575 0.72
SCHEMBL10358574 0.72
SCHEMBL10638758 0.70
SCHEMBL450126 0.70
SCHEMBL3382992 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114502661-A Fluorine-containing curable composition and article 信越化学工业株式会社 2022-05-13 CN disclosed
EP-1619212-B1 REACTIVE MODIFIER KANEKA CORP (JP) 2008-08-06 EP disclosed
US-7385006-B2 Reactive modifier KANEKA CORPORATION (JP) 2008-06-10 US disclosed
EP-1445283-B1 CURABLE RESIN COMPOSITION KANEKA CORP (JP) 2007-09-05 EP disclosed
US-7144953-B2 Material handling; radiation transparent; adhesives KANEKA CORPORATION (JP) 2006-12-05 US disclosed
US-20060199918-A1 Reactive modifier KANEKA CORPORATION (JP) 2006-09-07 US disclosed
EP-1619212-A1 REACTIVE MODIFIER KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
US-20050004327-A1 Material handling; radiation transparent; adhesives KANEKA CORPORATION (JP) 2005-01-06 US disclosed
EP-1445283-A1 CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2004-08-11 EP disclosed