SCHEMBL5077840

SCHEMBL5077840

CCCCCCCCC=CCCCCCCCCCCCCNC(=O)CCCCC(=O)NCCCCCCCCCCCCC=CCCCCCCCC

nearest known ligand 0.88

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
▸ EPHX2 P34913 2/20 0.88
▸ SLC6A5 Q9Y345 2/20 0.85
▸ CNR1 P21554 5/20 0.76
▸ KDM4E B2RXH2 1/20 0.75
▸ LPAR1 Q92633 1/20 0.75
▸ ALDH1A1 P00352 2/20 0.74
▸ HPGD P15428 2/20 0.74
▸ TRPV1 Q8NER1 1/20 0.74
▸ MEN1 O00255 1/20 0.74
▸ MAPT P10636 1/20 0.74
▸ ALOX12 P18054 1/20 0.74
▸ BLM P54132 1/20 0.74
▸ KMT2A Q03164 1/20 0.74
▸ TDP1 Q9NUW8 1/20 0.74

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6682385 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL3765726 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL3375110 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL25334864 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL195034 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL24233390 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL10481762 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL20987095 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL22716596 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1
SCHEMBL3375090 1.00 EPHX2 (0.88) EPHX2SLC6A5CNR1KDM4ELPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070221268-A1 Encapsulants for electronic components E. I. DU PONT DE NEMOURS AND COMPANY 2007-09-27 — — US claimed
US-6528174-B1 Mixture with alkylene bisoleamide and ionomer; melt processability E. I. DU PONT DE NEMOURS & CO. 2003-03-04 — — US claimed
US-RE32325-E DIUNSATURATED DIAMIDE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1987-01-06 — — US claimed
US-4510281-A ADDING ETHYLENEBISAMIDE AND-OR DIAPITPAMIDE DERIVATIVES TO POLYMER E. I. DU PONT DE NEMOURS AND COMPANY (US) 1985-04-09 — — US claimed
EP-1997164-A2 ENCAPSULANTS FOR ELECTRONIC COMPONENTS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-12-03 — — EP disclosed
WO-2007109283-A2 ENCAPSULANTS FOR ELECTRONIC COMPONENTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-09-27 — — WO disclosed
US-20070221268-A1 Encapsulants for electronic components E. I. DU PONT DE NEMOURS AND COMPANY 2007-09-27 — — US disclosed
EP-1705219-A1 Process for producing ethylene vinyl acetate film E.I.Du pont de nemours and company (US) 2006-09-27 — — EP disclosed
EP-0929602-B1 IMPROVED ETHYLENE VINYL ACETATE COMPOSITIONS AND FILM AND METHODS RELATED THERETO DU PONT (US) 2006-05-17 — — EP disclosed
WO-2005035643-A2 INORGANIC ANTIBLOCK EXXONMOBIL CHEMICAL PATENTS INC. (US) 2005-04-21 — — WO disclosed
US-20050065250-A1 Inorganic antiblock EXXONMOBIL CHEMICAL PATENTS INC. 2005-03-24 — — US disclosed
US-20030049478-A1 Process for preparing improved ethylene vinyl acetate compositions and films VOGEL RANDALL ALLEN (US) 2003-03-13 — — US disclosed
US-6528174-B1 Mixture with alkylene bisoleamide and ionomer; melt processability E. I. DU PONT DE NEMOURS & CO. 2003-03-04 — — US disclosed
EP-0929602-A4 IMPROVED ETHYLENE VINYL ACETATE COMPOSITIONS AND FILM AND METHODS RELATED THERETO DU PONT (US) 2001-10-10 — — EP disclosed
EP-0929602-A1 IMPROVED ETHYLENE VINYL ACETATE COMPOSITIONS AND FILM AND METHODS RELATED THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 1999-07-21 — — EP disclosed
WO-1998014512-A1 IMPROVED ETHYLENE VINYL ACETATE COMPOSITIONS AND FILM AND METHODS RELATED THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 1998-04-09 — — WO disclosed
EP-0521426-B1 N,N'-hexamethylen-1,6-bis-erucamid containing thermoplastic polyolefin moulding composition BASF AG (DE) 1996-02-28 — — EP disclosed
EP-0521426-A1 N,N'-hexamethylen-1,6-bis-erucamid containing thermoplastic polyolefin moulding composition BASF Aktiengesellschaft (DE) 1993-01-07 — — EP disclosed
US-RE32325-E DIUNSATURATED DIAMIDE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1987-01-06 — — US disclosed
US-4510281-A ADDING ETHYLENEBISAMIDE AND-OR DIAPITPAMIDE DERIVATIVES TO POLYMER E. I. DU PONT DE NEMOURS AND COMPANY (US) 1985-04-09 — — US disclosed
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