SCHEMBL5079136

SCHEMBL5079136

[CH2]c1cccc(C)c1[CH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL201778 0.84
SCHEMBL231107 0.77
SCHEMBL27384 0.75
SCHEMBL23360800 0.73
SCHEMBL715435 0.72
SCHEMBL1005311 0.72
SCHEMBL6742827 0.72
SCHEMBL11499143 0.72
SCHEMBL11848474 0.72 CYP1A2 (0.68)
SCHEMBL7532160 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0149765-B1 COATING COMPOSITIONS CONTAINING A KETIMINE AMERICAN CYANAMID COMPANY (US) 1990-03-28 EP claimed
CN-111954848-B Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2024-05-03 CN disclosed
CN-109153653-B Novel compound, photocurable composition, cured product thereof, printing ink, and printed matter using the printing ink DIC株式会社 2022-06-28 CN disclosed
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink DIC CORPORATION (JP) 2021-08-03 US disclosed
CN-111954848-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
EP-3050906-B1 CATALYST PROCESS MODIFICATION AND POLYMERIZATION THEREOF INDIAN OIL CORP LTD (IN) 2020-07-22 EP disclosed
WO-2019198490-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK DIC CORPORATION (JP) 2019-05-09 US disclosed
US-9873752-B2 Catalyst process modification and polymerization thereof INDIAN OIL CORPORATION LTD. (IN) 2018-01-23 US disclosed
EP-3050906-A1 CATALYST PROCESS MODIFICATION AND POLYMERIZATION THEREOF Indian Oil Corporation Limited (IN) 2016-08-03 EP disclosed
US-5691271-A MULTICOLOR; HEAT SENSITIVE RECORDING MEDIA FUJI PHOTO FILM CO., LTD. (JP) 1997-11-25 US disclosed
EP-0468928-B1 Piperidine-triazine compounds containing tetrahydrofuran or tetrahydropyran groups, for use as stabilizers for organic materials CIBA GEIGY AG (CH) 1996-10-23 EP disclosed
US-5336706-A Radiation, heat and oxidation resistance for Polypropylene fibers CIBA-GEIGY CORPORATION (US) 1994-08-09 US disclosed
US-5256787-A Chemical intermediates for piperidine triazine; photostability , radiation, oxidation and heat resistance CIBA-GEIGY CORPORATION (US) 1993-10-26 US disclosed
EP-0553594-A1 Polymeric thermoplastic materials, comprising 1,2,4-triazolidine-3,5-dione derivatives as stabilisers CIBA-GEIGY AG (CH) 1993-08-04 EP disclosed
US-5196465-A Heat resistance CIBA-GEIGY CORPORATION (US) 1993-03-23 US disclosed
US-5187275-A Light, heat and oxidation stabilizers CIBA-GEIGY CORPORATION (US) 1993-02-16 US disclosed
EP-0479724-A2 Piperidine-triazine compounds for use as stabilisers for organic materials CIBA-GEIGY AG (CH) 1992-04-08 EP disclosed
US-5091450-A Light, heat, oxidation resistance CIBA-GEIGY CORPORATION (US) 1992-02-25 US disclosed
EP-0468928-A2 Piperidine-triazine compounds containing tetrahydrofuran or tetrahydropyran groups, for use as stabilizers for organic materials CIBA-GEIGY AG (CH) 1992-01-29 EP disclosed