Sulfuric Acid

Sulfuric Acid

SCHEMBL5082148

O=S(=O)([O-])[O-].O=S(=O)([O-])[O-].O=S(=O)([O-])[O-].[N].[N].[Rh+3].[Rh+3]

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.42
ALDH1A1 P00352 1/20 0.42
TSHR P16473 1/20 0.42
KMT2A Q03164 1/20 0.42
TP53 P04637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL138365 0.94 MEN1 (0.46) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL17289024 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL54795 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL1255907 0.88
Sulfuric Acid SCHEMBL4471345 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL1007306 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL7758766 0.88
Sulfuric Acid SCHEMBL11045817 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL619676 0.88
Sulfuric Acid SCHEMBL11582675 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113345624-A Insulating coated conductive particle, anisotropic conductive adhesive, and connection structure 昭和电工材料株式会社 2021-09-03 CN disclosed
CN-108604480-B Conductive particle, insulation-coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle 日立化成株式会社 2020-03-24 CN disclosed
CN-108701508-B Conductive particle, insulation-coated conductive particle, anisotropic conductive adhesive, connection structure, and method for producing conductive particle 日立化成株式会社 2020-03-24 CN disclosed
US-20140217328-A1 Electroless Plating in Microchannels VELOCYS INC (US) 2014-08-07 US disclosed
US-8648006-B2 Electroless plating in microchannels VELOCYS, INC. (US) 2014-02-11 US disclosed
EP-1934383-B1 ELECTROLESS PLATING IN MICROCHANNELS VELOCYS INC (US) 2012-11-14 EP disclosed
US-20080214884-A1 Electroless plating in microchannels VELOCYS INC. (US) 2008-09-04 US disclosed
EP-1934383-A2 ELECTROLESS PLATING IN MICROCHANNELS Velocys, Inc. (US) 2008-06-25 EP disclosed
WO-2007047374-A2 ELECTROLESS PLATING IN MICROCHANNELS VELOCYS, INC. (US) 2007-04-26 WO disclosed