SCHEMBL5086772

SCHEMBL5086772

CCCCCCCCCCCC[n+]1cc[nH]c1C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 4/20 0.46
KMT2A Q03164 4/20 0.42
MEN1 O00255 3/20 0.42
MAPT P10636 2/20 0.42
TP53 P04637 1/20 0.42
CYP1A2 P05177 1/20 0.42
CYP2D6 P10635 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
SMN1; SMN2 Q16637 4/20 0.41
LMNA P02545 3/20 0.41
KDM4E B2RXH2 2/20 0.41
NPC1 O15118 2/20 0.41
RAB9A P51151 2/20 0.41
RAD52 P43351 4/20 0.41
HSP90AA1 P07900 3/20 0.41
MAPK1 P28482 2/20 0.41
RGS12 O14924 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2328683 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL5090775 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL29726515 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL9935730 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL363480 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL1137199 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL5287538 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
SCHEMBL9902243 1.00 HTT (0.46) HTTKMT2AMEN1MAPTTP53
Bromide SCHEMBL17027655 0.98 HTT (0.44) HTTKMT2AMEN1MAPTTP53
Bromide SCHEMBL193259 0.98 HTT (0.44) HTTKMT2AMEN1MAPTTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024043165-A1 CURABLE COMPOSITION AND COMPOSITE MATERIAL 日東電工株式会社 2024-02-29 WO disclosed
CN-115968437-A Heat pipe, system and method for switching and/or programming heat transfer 弗劳恩霍夫应用研究促进协会 2023-04-14 CN disclosed
CN-115910936-A Sealing resin sheet and electronic component device 日东电工株式会社 2023-04-04 CN disclosed
CN-115485820-A Method for producing cured resin sheet with electrode, and thermosetting resin sheet 日东电工株式会社 2022-12-16 CN disclosed
CN-115377016-A Sealing resin sheet and electronic component device 日东电工株式会社 2022-11-22 CN disclosed
WO-2022190898-A1 METHOD FOR MANUFACTURING CURED RESIN SHEET WITH ELECTRODE, CURED RESIN SHEET WITH ELECTRODE, AND THERMOSETTING RESIN SHEET 日東電工株式会社 2022-09-15 WO disclosed
CN-114174424-A Sealing resin sheet 日东电工株式会社 2022-03-11 CN disclosed
CN-114174421-A Sealing resin sheet 日东电工株式会社 2022-03-11 CN disclosed
CN-114144469-A Sealing resin sheet 日东电工株式会社 2022-03-04 CN disclosed
CN-114144468-A Sealing resin sheet 日东电工株式会社 2022-03-04 CN disclosed
CN-114096412-A Multilayer resin sheet for sealing 日东电工株式会社 2022-02-25 CN disclosed
CN-114080427-A Sealing resin sheet 日东电工株式会社 2022-02-22 CN disclosed
US-9074083-B2 Polyolefin resin composition for metal coating, and resin film and resin-coated metal material using the same NIPPON STEEL & SUMITOMO METAL CORPORATION (JP) 2015-07-07 US disclosed
US-20080075962-A1 Polyolefin-Based Resin Composition for Metal Coating, and Resin Film and Resin-Coated Metal Material Using the Same NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2008-03-27 US disclosed