SCHEMBL51111

SCHEMBL51111

CCC1(CC)CCCC(CC)(CC)N1O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2865601 0.88
SCHEMBL16573508 0.85 TSHR (0.31)
SCHEMBL19860203 0.82
SCHEMBL22514001 0.82
SCHEMBL22401383 0.79
SCHEMBL10171058 0.74
SCHEMBL51110 0.72
SCHEMBL1721861 0.72
SCHEMBL16365345 0.72
SCHEMBL7937523 0.69 GAA (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 282 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115651053-A Preparation method of 3 alpha-5-cyclo-5 alpha-ergosta-22-ene-6-ketone 广东五洲药业有限公司 2023-01-31 CN claimed
WO-2015107071-A1 GENETICALLY ENCODED SPIN LABEL Universität Konstanz (DE) 2015-07-23 WO claimed
EP-2894476-A1 Genetically Encoded Spin Label Universität Konstanz (DE) 2015-07-15 EP claimed
US-20100043969-A1 METHOD FOR MOUNTING PRINTING PLATES TO PRINTING CYLINDERS OR SLEEVES WITH ADHESIVE TAPE TESA SE (DE) 2010-02-25 US claimed
EP-1590383-B1 PRESSURE-SENSITIVE ADHESIVE TAPE FOR THE ADHESION OF PRINTING PLATES AND METHOD FOR THE PRODUCTION THEREOF TESA AG (DE) 2009-04-08 EP claimed
US-20080044611-A1 Pressure Sensitive Adhesive Tape for the Adhesion of Printing Plates and Method for the Production Thereof TESA AG (DE) 2008-02-21 US claimed
EP-1590383-A2 PRESSURE-SENSITIVE ADHESIVE TAPE FOR THE ADHESION OF PRINTING PLATES AND METHOD FOR THE PRODUCTION THEREOF Tesa AG (DE) 2005-11-02 EP claimed
WO-2004067661-A2 TWO-STAGE FREE-RADICAL POLYMERIZATION METHOD FOR THE PRODUCTION OF PRESSURE-SENSITIVE ADHESIVES FOR PRESSURE-SENSITIVE ADHESIVE TAPES USED FOR BONDING PRINTING PLATES TESA AG (DE) 2004-08-12 WO claimed
US-20240218094-A1 PREPOLYMER, RESIN COMPOSITION COMPRISING THE SAME AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2024-07-04 US disclosed
US-20240218152-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2024-07-04 US disclosed
US-20240199791-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2024-06-20 US disclosed
US-20240182703-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2024-06-06 US disclosed
US-20240182702-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2024-06-06 US disclosed
US-20240158576-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2024-05-16 US disclosed
EP-1270700-A2 Adhesive particularly for unpolar surfaces Tesa AG (DE) 2003-01-02 EP disclosed
EP-1270701-A2 Adhesive particularly for unpolar surfaces Tesa AG (DE) 2003-01-02 EP disclosed
US-20020161129-A1 Concentrating, extrusion, applying to backing TESA SE (DE) 2002-10-31 US disclosed
EP-1234864-A2 Low-fogging pressure sensitive adhesives Tesa AG (DE) 2002-08-28 EP disclosed
WO-2002010308-A1 ADHESIVE MATERIAL BASED ON BLOCK COPOLYMERS HAVING A STRUCTURE P(A/C)-P(B)-P(A/C) TESA AG (DE) 2002-02-07 WO disclosed
WO-2002010307-A2 ADHESIVE MATERIAL BASED ON BLOCK COPOLYMERS HAVING A P(B)-P(A/C)-P(B) STRUCTURE TESA AG (DE) 2002-02-07 WO disclosed