SCHEMBL513193

SCHEMBL513193

C=CC(=O)OC(C)O.O=C(O)C1CCCCC1C(=O)O

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ACE P12821 1/20 0.36
TAAR1 Q96RJ0 1/20 0.35
TSHR P16473 1/20 0.34
CYP2C19 P33261 1/20 0.33
KDM4E B2RXH2 1/20 0.33
HTT P42858 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
PEPD P12955 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4940022 0.83 ACE (0.34) ACETAAR1TSHRCYP2C19KDM4E
SCHEMBL6297535 0.83 PEPD (0.33) TAAR1TSHRPEPD
Hydrogen Peroxide SCHEMBL28304770 0.82 TSHR (0.46) TSHRSMN1; SMN2ALDH1A1LMNA
SCHEMBL27904297 0.80 ACE (0.33) ACETAAR1TSHR
SCHEMBL20730 0.80
SCHEMBL10773528 0.80
SCHEMBL21630259 0.80 TSHR (0.48) TSHRSMN1; SMN2ALDH1A1LMNA
Acrylic Acid Methyl Ester SCHEMBL28783862 0.79 CYP2C19 (0.42) TSHRCYP2C19KDM4EHTTSMN1; SMN2
Acrylic Acid Methyl Ester SCHEMBL28240567 0.79 CYP2C19 (0.42) TSHRCYP2C19KDM4EHTTSMN1; SMN2
SCHEMBL1151516 0.78 TSHR (0.41) ACETAAR1TSHRALDH1A1PEPD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8593633-B2 Cure degree evaluation method, cure degree evaluation sheet, and cure degree evaluation system for evaluating cure degree of active energy ray-curable resin composition OMRON CORPORATION (JP) 2013-11-26 US disclosed
US-20120026501-A1 CURE DEGREE EVALUATION METHOD, CURE DEGREE EVALUATION SHEET, AND CURE DEGREE EVALUATION SYSTEM FOR EVALUATING CURE DEGREE OF ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION OMRON CORPORATION (JP) 2012-02-02 US disclosed
EP-0793406-B1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO LTD (JP) 2005-12-28 EP disclosed
US-6228465-B1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 2001-05-08 US disclosed
US-6010956-A Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 2000-01-04 US disclosed
EP-0793406-A1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 1997-09-03 EP disclosed