SCHEMBL513194

SCHEMBL513194

C=CC(=O)OCCO.O=C(O)C1CCCCC1C(=O)O

nearest known ligand 0.63

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.63
ALDH1A1 P00352 4/20 0.44
TP53 P04637 3/20 0.44
HIF1A Q16665 3/20 0.44
CYP3A4 P08684 2/20 0.44
HSD17B10 Q99714 1/20 0.44
HPGD P15428 1/20 0.41
THRB P10828 2/20 0.38
MAPK1 P28482 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
PEPD P12955 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6297537 0.90 TSHR (0.50) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL513195 0.85 TSHR (0.61) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL35406 0.85 TSHR (0.47) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL19088718 0.85 TSHR (0.47) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL27967541 0.84 TSHR (0.46) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL27646655 0.83 TSHR (0.67) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL28175206 0.83 TSHR (0.49) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL9062770 0.83 TSHR (0.53) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL23963474 0.82 TSHR (0.47) TSHRALDH1A1TP53HIF1ACYP3A4
Cyclopropane SCHEMBL11750295 0.82 TSHR (0.86) TSHRALDH1A1TP53HIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116888232-A Adhesive for display device and adhesive sheet using same 株式会社巴川制纸所 2023-10-13 CN disclosed
CN-105968001-B Carboxyl group-containing reactive compound, curable resin composition using same, and cured product 日本化药株式会社 2020-05-08 CN disclosed
CN-105968001-A Carboxyl-containing reactive compound, hardened resin composition using same, and hardened substance 日本化药株式会社 2016-09-28 CN disclosed
US-8593633-B2 Cure degree evaluation method, cure degree evaluation sheet, and cure degree evaluation system for evaluating cure degree of active energy ray-curable resin composition OMRON CORPORATION (JP) 2013-11-26 US disclosed
US-20120026501-A1 CURE DEGREE EVALUATION METHOD, CURE DEGREE EVALUATION SHEET, AND CURE DEGREE EVALUATION SYSTEM FOR EVALUATING CURE DEGREE OF ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION OMRON CORPORATION (JP) 2012-02-02 US disclosed
EP-0793406-B1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO LTD (JP) 2005-12-28 EP disclosed
US-6228465-B1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 2001-05-08 US disclosed
US-6010956-A Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 2000-01-04 US disclosed
EP-0793406-A1 Process for producing multilayer wiring boards TOKYO OHKA KOGYO CO., LTD. (JP) 1997-09-03 EP disclosed