SCHEMBL515777

SCHEMBL515777

C=CC(=O)OC(CC)NCC

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.38
HPGD P15428 1/20 0.37
THRB P10828 2/20 0.35
ALDH1A1 P00352 4/20 0.32
TP53 P04637 2/20 0.32
HIF1A Q16665 2/20 0.32
CYP3A4 P08684 1/20 0.32
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28118746 0.87 TSHR (0.37) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL2515419 0.85 TSHR (0.39) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL11590481 0.85 TSHR (0.39) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL11150004 0.84 HCAR2 (0.38)
SCHEMBL3281773 0.84 TSHR (0.43) TSHRHPGD
SCHEMBL515831 0.82 TSHR (0.39) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL11497592 0.82 TSHR (0.39) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL3287533 0.82 TSHR (0.44) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL10382473 0.81 TSHR (0.43) TSHRHPGDTHRBALDH1A1
SCHEMBL9411322 0.81 TSHR (0.38) TSHRHPGDTHRBALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 163 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150094448-A1 SMART POLYMER MATERIALS WITH EXCESS REACTIVE MOLECULES MEDIPACS, INC. 2015-04-02 US claimed
EP-2847249-A1 SMART POLYMER MATERIALS WITH EXCESS REACTIVE MOLECULES Medipacs, Inc. (US) 2015-03-18 EP claimed
CN-104302689-A Smart polymer materials with excess reactive molecules MEDIPACS INC 2015-01-21 CN claimed
WO-2013138524-A1 SMART POLYMER MATERIALS WITH EXCESS REACTIVE MOLECULES MEDIPACS, INC. (US) 2013-09-19 WO claimed
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US claimed
US-20060181587-A1 Ink set and media for ink-jet printing HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2006-08-17 US claimed
US-4129610-A VINYL COPOLYMER, EPOXY RESIN HITACHI CHEMICAL CO., LTD. 1978-12-12 US claimed
EP-3870656-B1 ACRYLIC POLYMERS FOR INKJET INK APPLICATIONS CABOT CORP (US) 2026-03-18 EP disclosed
US-12486434-B2 Adhesive film, scattering prevention film comprising the same and optical display apparatus comprising the same SAMSUNG SDI CO., LTD. (KR) 2025-12-02 US disclosed
US-20250224314-A1 DEVICE FOR TISSUE SECTION IMMOBILIZATION AND RETENTION Singular Genomics Systems, Inc. 2025-07-10 US disclosed
US-12298211-B2 Device for tissue section immobilization and retention Singular Genomics Systems, Inc. (US) 2025-05-13 US disclosed
US-20250067638-A1 DEVICE FOR TISSUE SECTION IMMOBILIZATION AND RETENTION FIRST-CITIZENS BANK & TRUST COMPANY 2025-02-27 US disclosed
US-20250067639-A1 METHOD FOR TISSUE SECTION IMMOBILIZATION AND RETENTION FIRST-CITIZENS BANK & TRUST COMPANY 2025-02-27 US disclosed
US-6074761-A COATING COMPRISES A BINDER CONSISTS OF ORGANIC POLYMER FREE OR AMMONIUM GROUPS, A CATIONIC ADDITION POLYMER CONTAINING QUATERNARY AMMONIUM GROUP, A SECOND ADDITION CATION POLYMER CONTAINING SECONDARY OR TERTIARY AMINE GROUPS, AND A FILLER PPG INDUSTRIES OHIO, INC. (US) 2000-06-13 US disclosed
EP-0988152-A1 COATING COMPOSITION AND PRINTING MEDIUM PPG Industries Ohio, Inc. (US) 2000-03-29 EP disclosed
EP-0988154-A1 COATING COMPOSITION AND PRINTING MEDIUM PPG Industries Ohio, Inc. (US) 2000-03-29 EP disclosed
US-5880196-A VOLATILE AQUEOUS LIQUID MEDIUM CONTAINING ONIUM-FREE AND ONIUM-CONTAINING POLYMERIC BINDERS, FINELY DIVIDED PSEUDOBOEHMITE PARTICLES; NONBLEEDING PPG INDUSTRIES, INC. (US) 1999-03-09 US disclosed
WO-1998056591-A1 COATING COMPOSITION AND PRINTING MEDIUM PPG INDUSTRIES OHIO, INC. (US) 1998-12-17 WO disclosed
WO-1998056592-A1 COATING COMPOSITION AND PRINTING MEDIUM PPG INDUSTRIES OHIO, INC. (US) 1998-12-17 WO disclosed
US-4129610-A VINYL COPOLYMER, EPOXY RESIN HITACHI CHEMICAL CO., LTD. 1978-12-12 US disclosed