Formaldehyde

Formaldehyde

SCHEMBL5158115

C=O.CCl.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formaldehyde SCHEMBL3375178 0.93
Ethylene SCHEMBL1775779 0.77
Formaldehyde SCHEMBL3341363 0.76
Formaldehyde SCHEMBL15995003 0.76
Formaldehyde SCHEMBL2590690 0.76
Chloromethane SCHEMBL134370 0.76
Chloromethane SCHEMBL1628574 0.76
Chloromethane SCHEMBL10859639 0.76
Formaldehyde SCHEMBL918419 0.76
Formaldehyde SCHEMBL23711596 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1215236-B1 A latex for dip molding and a dip molded product NIPPON A & L INC (JP) 2007-02-14 EP disclosed
CN-1215136-C Latex for dip molding and dip molded product NIPPON A & L LTD (JP) 2005-08-17 CN disclosed
US-6870019-B2 Latex for dip molding and a dip molded product NIPPON A & L INC. (JP) 2005-03-22 US disclosed
US-20020111431-A1 Latex for dip molding and a dip molded product NIPPON A & L INC. (JP) 2002-08-15 US disclosed
CN-1358808-A Rubber latex for dhip moulding and dip moulding products TAKEDA CHEMICA IND LTD (JP) 2002-07-17 CN disclosed
EP-1215236-A2 A latex for dip molding and a dip molded product Takeda Chemical Industries, Ltd. (JP) 2002-06-19 EP disclosed