SCHEMBL515970

SCHEMBL515970

CCC(OC)O[Si](C)(OC(CC)OC)OC(CC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5367184 0.83
SCHEMBL4137292 0.83
SCHEMBL661638 0.80
SCHEMBL28648887 0.76
SCHEMBL26030 0.75
SCHEMBL23295170 0.72
Water SCHEMBL28555745 0.72
Ammonia Solution, Strong SCHEMBL4994633 0.72
Hydrochloric Acid SCHEMBL1844020 0.72
SCHEMBL984824 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2965904-B1 MULTILAYER STRUCTURE MANUFACTURING METHOD FUJIFILM CORP (JP) 2020-04-22 EP disclosed
EP-2965904-A1 MULTILAYER STRUCTURE, MULTILAYER STRUCTURE MANUFACTURING METHOD AND COMPOSITION SET FUJIFILM Corporation (JP) 2016-01-13 EP disclosed
EP-2492296-B1 Resin composition for laser engraving, relief printing plate precursor and process for producing the same, and relief printing plate FUJIFILM CORP (JP) 2015-12-16 EP disclosed
US-8859669-B2 Process for producing relief printing plate precursor for laser engraving, relief printing plate precursor for laser engraving, process for making relief printing plate, and relief printing plate FUJIFILM CORPORATION (JP) 2014-10-14 US disclosed
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
US-8652760-B2 Printing plate precursor for laser engraving, printing plate, and method for producing printing plate FUJIFILM CORPORATION (JP) 2014-02-18 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
EP-2236290-B1 Printing plate precursor for laser engraving , printing plate, and method for producing printing plate FUJIFILM CORP (JP) 2011-09-07 EP disclosed
EP-2236290-A1 Printing plate precursor for laser engraving , printing plate, and method for producing printing plate Fujifilm Corporation (JP) 2010-10-06 EP disclosed
US-20100248139-A1 PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PRINTING PLATE, AND METHOD FOR PRODUCING PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100243624-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
US-7193026-B2 Organosilicon compound-curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-20 US disclosed
US-20040260048-A1 Organosilicon compound - curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-23 US disclosed
EP-0608888-B1 To elastomers crosslinkable polyorganosiloxane compositions WACKER CHEMIE GMBH (DE) 1999-12-01 EP disclosed
US-5371165-A Crosslinkable nontoxic coating compositions comprising a copolymer of a polysiloxane and an unsaturated monomer, a silicate or silanetriol and a phosphate WACKER-CHEMIE GMBH (DE) 1994-12-06 US disclosed
EP-0608888-A1 To elastomers crosslinkable polyorganosiloxane compositions Wacker-Chemie GmbH (DE) 1994-08-03 EP disclosed