Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | GMNN | O75496 | 1/20 | 0.30 |
| ▸ | PPM1B | O75688 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.30 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.30 |
| ▸ | RAB9A | P51151 | 1/20 | 0.30 |
| ▸ | PPP5C | P53041 | 1/20 | 0.30 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.30 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.30 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.30 |
| ▸ | THPO | P40225 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18346644 | 0.85 | — | — | |
| SCHEMBL8120428 | 0.85 | TLR4 (0.35) | — | |
| SCHEMBL12172578 | 0.83 | KDM4E (0.32) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL12110854 | 0.83 | KDM4E (0.32) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL8110967 | 0.82 | CYP1A2 (0.40) | LMNATP53 | |
| SCHEMBL28674359 | 0.80 | KDM4E (0.30) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL28677998 | 0.80 | KDM4E (0.30) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL10666775 | 0.79 | CYP1A2 (0.45) | SMN1; SMN2 | |
| SCHEMBL28896019 | 0.78 | TLR4 (0.31) | — | |
| SCHEMBL24453323 | 0.78 | KDM4E (0.40) | KDM4EGMNNPPM1BLMNAPPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108531122-A | A kind of solvent-free two-part reaction type polyurethane adhesive and its application method applied to woodworking | 广东中粘新材料科技有限公司 | 2018-09-14 | — | — | CN | claimed |
| CN-105330820-B | A kind of unsymmetric structure modified epoxy acrylic ester resin and its continuity method synthetic method | 浙江瑞通光电材料有限公司 | 2018-08-07 | — | — | CN | claimed |
| CN-103476895-B | Adhesive, adhesive material using same, and method for using same | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-103459544-B | Adhesive and adhesive material using same, and usage method therefor | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-103476894-B | Adhesive, adhesive material using same, and method for using same | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-105330820-A | Asymmetric-structure modified epoxy acrylic resin and continuous method synthetic method | SUZHOU MINDA POLYMER SCI TECH MATERIAL CO LTD | 2016-02-17 | — | — | CN | claimed |
| US-5100767-A | Epoxy resins | TAMURA KAKEN CO., LTD. (JP) | 1992-03-31 | — | — | US | claimed |
| JP-3277622-A | — | — | None | — | — | JP | disclosed |
| CN-109283792-B | Photosensitive composition, pattern forming method, cured product and display device | 东京应化工业株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-117471850-A | Photosensitive composition, method for producing patterned cured product, and black matrix | 东京应化工业株式会社 | 2024-01-30 | — | — | CN | disclosed |
| US-20240027889-A1 | METAL OXIDE FILM-FORMING COMPOSITION, METHOD FOR PRODUCING METAL OXIDE FILMS USING SAME, AND METHOD FOR REDUCING VOLUME SHRINKAGE RATIO OF METAL OXIDE FILMS | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20230416924-A1 | COMPOSITION FOR METAL OXIDE FILM FORMATION, METHOD FOR PRODUCING COMPOSITION FOR METAL OXIDE FILM FORMATION, AND METHOD FOR PRODUCING METAL OXIDE FILM USING THE COMPOSITION FOR METAL OXIDE FILM FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-12-28 | — | — | US | disclosed |
| WO-2023214540-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2023-11-09 | — | — | WO | disclosed |
| EP-0894808-A1 | Modified cellulose compound and photopolymerizable resin composition containing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-02-03 | — | — | EP | disclosed |
| US-5576399-A | Epoxy acrylates | CIBA-GEIGY CORPORATION (US) | 1996-11-19 | — | — | US | disclosed |
| CN-1102838-A | Epoxy acrylate | CIBA GEIGY AG (CH) | 1995-05-24 | — | — | CN | disclosed |
| EP-0632079-A1 | Epoxyacrylates | CIBA-GEIGY AG (CH) | 1995-01-04 | — | — | EP | disclosed |
| EP-0632078-A1 | Epoxyacrylates | CIBA-GEIGY AG (CH) | 1995-01-04 | — | — | EP | disclosed |
| US-5100767-A | Epoxy resins | TAMURA KAKEN CO., LTD. (JP) | 1992-03-31 | — | — | US | disclosed |
| JP-H03277622-A | EPOXY RESIN CURING AGENT | TONEN CORP | 1991-12-09 | — | — | JP | disclosed |