SCHEMBL5162832

SCHEMBL5162832

Cl[Sn](Cl)(Cl)Cl.[Pd]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL97522 0.89
SCHEMBL28660952 0.80
SCHEMBL28667056 0.80
Ammonia Solution, Strong SCHEMBL28367391 0.80
Water SCHEMBL29367115 0.80
Water SCHEMBL720910 0.80
SCHEMBL28443823 0.80
SCHEMBL11857506 0.80
SCHEMBL31556356 0.80
Water SCHEMBL29797427 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4683036-A APERTURE WALLS OF PRINTED CIRCUITS KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1987-07-28 US claimed
US-10963112-B1 Touch panel and method of forming thereof TPK ADVANCED SOLUTIONS INC. (CN) 2021-03-30 US disclosed
EP-1001440-B1 Switching structure and method of fabrication GEN ELECTRIC (US) 2007-04-04 EP disclosed
US-6655011-B1 Method for fabricating a switch structure GENERAL ELECTRIC COMPANY 2003-12-02 US disclosed
US-6297459-B1 Processing low dielectric constant materials for high speed electronics GENERAL ELECTRIC COMPANY 2001-10-02 US disclosed
US-6188301-B1 Switching structure and method of fabrication GENERAL ELECTRIC COMPANY 2001-02-13 US disclosed
EP-1001440-A2 Switching structure and method of fabrication GENERAL ELECTRIC COMPANY (US) 2000-05-17 EP disclosed
US-5785787-A Processing low dielectric constant materials for high speed electronics GENERAL ELECTRIC COMPANY (US) 1998-07-28 US disclosed
US-5730853-A Method for plating metal matrix composite materials with nickel and gold NORTHROP GRUMMAN CORPORATION (US) 1998-03-24 US disclosed
US-5703400-A Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers GENERAL ELECTRIC COMPANY (US) 1997-12-30 US disclosed
US-4626324-A Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards ALLIED CORPORATION (US) 1986-12-02 US disclosed
EP-0176736-A1 Process for selective metallization KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1986-04-09 EP disclosed
EP-0163059-A2 Novel nickel/indium alloy and method of using same in the manufacture of printed circuit boards ALLIED CORPORATION (US) 1985-12-04 EP disclosed
EP-0160236-A1 Novel nickel/indium alloy for use in the manufacture of electrical contact areas electrical devices ALLIED CORPORATION (US) 1985-11-06 EP disclosed
US-4551488-A SOLDER MASKS KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1985-11-05 US disclosed
US-4510276-A EPOXY RESIN AND CURING AGENT IN SOLVENT WITH FLOW CONTROL AGENT AND THICKENER KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1985-04-09 US disclosed
US-4504607-A Epoxy resin coating composition for printed circuit boards KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1985-03-12 US disclosed
US-4486466-A PRINTED CIRCUITS, THERMOSETTING RESIN KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1984-12-04 US disclosed
US-4425380-A Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions KOLLMORGEN TECHNOLOGIES CORPORATION (US) 1984-01-10 US disclosed
US-3963841-A Catalytic surface preparation for electroless plating INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1976-06-15 US disclosed