SCHEMBL517222

SCHEMBL517222

CC1=C(N)CCCC1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3966809 0.95 CA1 (0.46)
SCHEMBL516429 0.84
SCHEMBL4629485 0.77
SCHEMBL5395365 0.75
SCHEMBL915046 0.74
Methyl Alcohol SCHEMBL5708596 0.70 CA1 (0.41)
SCHEMBL11519071 0.70
SCHEMBL7608454 0.70 CA1 (0.37)
SCHEMBL1053411 0.69 CA1 (0.50)
SCHEMBL3955331 0.68 CA1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
CN-103135347-A Resin composition for laser engraving, flexographic printing plate precursor for laser engraving and process for producing same, and flexographic printing plate and process for making same FUJIFILM CORP 2013-06-05 CN disclosed
US-20130133537-A1 RESIN COMPOSITION FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND FLEXOGRAPHIC PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2013-05-30 US disclosed
EP-2565046-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-20130047878-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed
EP-2481583-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same Fujifilm Corporation (JP) 2012-08-01 EP disclosed
CN-102540712-A Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORP 2012-07-04 CN disclosed
US-20120146264-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-06-14 US disclosed
US-20120135196-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed
US-20120024224-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-02-02 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed