SCHEMBL51759

SCHEMBL51759

NNN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3510 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12428727-B2 Cyclic film deposition using reductant gas TOKYO ELECTRON LIMITED (JP) 2025-09-30 US claimed
US-20250081588-A1 METHODS FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES ASM IP HOLDING B.V. (NL) 2025-03-06 US claimed
WO-2025049700-A1 COMPOSITIONS AND METHODS FOR NUCLEIC ACID SEQUENCING ILLUMINA, INC. (US) 2025-03-06 WO claimed
CN-119465067-A Method for depositing a molybdenum metal film on a dielectric surface of a substrate by a cyclical deposition process and associated semiconductor device structure ASM IP控股有限公司 2025-02-18 CN claimed
CN-119301299-A Cyclic film deposition using reducing agent gas 东京毅力科创株式会社 2025-01-10 CN claimed
US-12166099-B2 Methods for forming a semiconductor device structure and related semiconductor device structures ASM IP HOLDING B.V. (NL) 2024-12-10 US claimed
US-20240363334-A1 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS Kokusai Electric Corporation (JP) 2024-10-31 US claimed
CN-116196903-B Aqueous phase radioactive anion adsorbent based on anion-pi action 中南大学 2024-10-18 CN claimed
US-12077653-B2 Build materials for photochemical additive manufacturing applications UNIVERSITY OF SOUTH ALABAMA (US) 2024-09-03 US claimed
CN-117205718-B Capturing and fixing CO2Composite material of (2), preparation method and CO2Absorption device 青岛理工大学 2024-05-14 CN claimed
US-4417021-A POLYAMIDES, POLYHYDRAZIDES AS NUCLEATION AGENTS, MOLDING ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1983-11-22 US claimed
US-4374135-A AMIDINO HYDRAZONE COMPOUNDS AMERICAN CYANAMID COMPANY (US) 1983-02-15 US claimed
US-4353962-A USING AN ACRYLIC POLYMER ENVIRONMENTAL CHEMICALS, INC. (US) 1982-10-12 US claimed
US-4338426-A Intermediate, copolymer resin and production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1982-07-06 US claimed
EP-0039155-A1 Polyester molding composition, production thereof and molded articles produced therefrom Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1981-11-04 EP claimed
US-4225485-A Chemiluminescent naphthalene-1,2-dicarboxylic acid hydrazide-labeled polypeptides and proteins MILES LABORATORIES, INC. (US) 1980-09-30 US claimed
US-4225702-A Method of preparing polyamide acid type intermediates for processing of semiconductors HITACHI CHEMICAL COMPANY, LTD. (JP) 1980-09-30 US claimed
US-4109094-A EXHAUSTIVE; REPETATIVE NEUTRALIZATION ASHLAND OIL, INC. (US) 1978-08-22 US claimed
US-4082708-A POT LIFE, EPOXY RESIN CURING AGENTS H. B. FULLER COMPANY (US) 1978-04-04 US claimed
US-4040083-A ALUMINUM OXIDE LAYER BONDING POLYMER RESIN LAYER TO SEMICONDUCTOR DEVICE HITACHI, LTD. (JA) 1977-08-02 US claimed