SCHEMBL5178147

SCHEMBL5178147

I/C=C\I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2264148 1.00
SCHEMBL17055587 0.68
SCHEMBL1306210 0.68
SCHEMBL18290883 0.68
SCHEMBL20768170 0.68
SCHEMBL20768171 0.68
SCHEMBL38267 0.67
SCHEMBL150696 0.63
SCHEMBL1866728 0.63
SCHEMBL20768174 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116705595-A Underlayer for photoresist adhesion and dose reduction 朗姆研究公司 2023-09-05 CN claimed
EP-4591122-A1 BAKE-SENSITIVE UNDERLAYERS TO REDUCE DOSE TO SIZE OF EUV PHOTORESIST Lam Research Corporation (US) 2025-07-30 EP disclosed
US-20240255850-A1 UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION LAM RES CORP (US) 2024-08-01 US disclosed
WO-2024064071-A1 BAKE-SENSITIVE UNDERLAYERS TO REDUCE DOSE TO SIZE OF EUV PHOTORESIST LAM RESEARCH CORPORATION (US) 2024-03-28 WO disclosed
US-20230360922-A1 ROBUST ASHABLE HARD MASK LAM RESEARCH CORPORATION 2023-11-09 US disclosed
CN-116705595-A Underlayer for photoresist adhesion and dose reduction 朗姆研究公司 2023-09-05 CN disclosed
CN-113574456-B Underlayer for photoresist adhesion and dose reduction 朗姆研究公司 2023-05-26 CN disclosed
CN-115735262-A Robust ashable hard mask 朗姆研究公司 2023-03-03 CN disclosed
CN-114200776-A Underlayer for photoresist adhesion and dose reduction 朗姆研究公司 2022-03-18 CN disclosed
EP-1988764-B2 SCREENING METHOD FOR SELECTING PLANTS THAT SHOW A REDUCED WOUND-INDUCED SURFACE DISCOLOURATION RIJK ZWAAN ZAADTEELT EN ZAADHANDEL BV (NL) 2016-11-16 EP disclosed
WO-2011109587-A1 SUBSTITUTED AZA-BICYCLIC IMIDAZOLE DERIVATIVES USEFUL AS TRPM8 RECEPTOR MODULATORS JANSSEN PHARMACEUTICA NV (BE) 2011-09-09 WO disclosed
US-7360588-B2 Thermal processes for subsurface formations SHELL OIL COMPANY (US) 2008-04-22 US disclosed
EP-1188807-B1 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing JSR CORP (JP) 2007-10-17 EP disclosed
EP-1099719-B1 Diyne-containing (co) polymer, processes for producing the same, and cured film JSR CORP (JP) 2007-01-17 EP disclosed
US-7153767-B2 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing JSR CORPORATION (JP) 2006-12-26 US disclosed
US-20050003218-A1 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing JSR CORPORATION (JP) 2005-01-06 US disclosed
US-6528605-B1 Diyne-containing (co)polymer, processes for producing the same, and cured film JSR CORPORATION (JP) 2003-03-04 US disclosed
US-20020064953-A1 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing JSR CORPORATION (JP) 2002-05-30 US disclosed
EP-1188807-A2 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing JSR Corporation (JP) 2002-03-20 EP disclosed
EP-1099719-A1 Diyne-containing (co) polymer, processes for producing the same, and cured film JSR Corporation (JP) 2001-05-16 EP disclosed