SCHEMBL5178235

SCHEMBL5178235

CCCCCC[C@@H](O)C/C=C\CCCCCCC(CCCCC(C)=O)C(=O)O

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 2/20 0.71
FFAR4 Q5NUL3 2/20 0.71
FAAH O00519 3/20 0.63
NFKB1 P19838 1/20 0.54
NFKB2 Q00653 1/20 0.54
RELA Q04206 1/20 0.54
PPARG P37231 5/20 0.48
TERT O14746 3/20 0.48
PTPN1 P18031 3/20 0.48
PPARD Q03181 3/20 0.48
PPARA Q07869 3/20 0.48
MAPT P10636 2/20 0.48
BLM P54132 2/20 0.48
HSD17B10 Q99714 2/20 0.48
FABP4 P15090 2/20 0.48
GMNN O75496 1/20 0.48
USP2 O75604 1/20 0.48
LMNA P02545 1/20 0.48
CYP1A2 P05177 1/20 0.48
POLB P06746 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1537809 0.97 FFAR1 (0.67) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL20039910 0.92 FFAR1 (0.78) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL26393254 0.92 FFAR1 (0.78) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL26868694 0.92 FFAR1 (0.78) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL13352197 0.92 FFAR1 (0.78) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL27496579 0.92 FFAR1 (0.74) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL30448281 0.92 FFAR1 (0.74) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL17780274 0.91 FFAR1 (0.87) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL5449873 0.91 FFAR1 (0.72) FFAR1FFAR4FAAHNFKB1NFKB2
SCHEMBL17081145 0.88 FFAR1 (0.71) FFAR1FFAR4FAAHNFKB1NFKB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1596113-B1 Thermoplastic polyamide moulding matters EMS CHEMIE AG (CH) 2007-06-13 EP disclosed
US-7151127-B2 Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings EMS-CHEMIE AG (CH) 2006-12-19 US disclosed
EP-1596113-A1 Thermoplastic polyamide moulding matters EMS-Chemie AG (CH) 2005-11-16 EP disclosed
US-20050148728-A1 Use of thermoplastic polyamide moulding compositions with reduced formation of solid deposits and/or coverings EMS-CHEMIE AG (CH) 2005-07-07 US disclosed
EP-1550684-A2 Use of thermoplastic polyamide moulding compositions showing reduced formation of solid deposits EMS-Chemie AG (CH) 2005-07-06 EP disclosed
EP-0710268-B1 USE OF SELECTED POLYVINYL ACETATE DISPERSIONS FOR SOLIDIFYING THE SURFACE OF SAND AND/OR EARTH HENKEL KGAA (DE) 1997-04-23 EP disclosed
EP-0710268-A1 USE OF SELECTED POLYVINYL ACETATE DISPERSIONS FOR SOLIDIFYING THE SURFACE OF SAND AND/OR EARTH HENKEL KGAA (DE) 1996-05-08 EP disclosed
WO-1995003372-A1 USE OF SELECTED POLYVINYL ACETATE DISPERSIONS FOR SOLIDIFYING THE SURFACE OF SAND AND/OR EARTH HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1995-02-02 WO disclosed