2-Mercaptopyrimidine

2-Mercaptopyrimidine

SCHEMBL51787

Sc1ncccn1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 10894 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122054800-A Perovskite battery, preparation method thereof and photovoltaic module 东方日升新能源股份有限公司 2026-05-15 CN claimed
US-12550694-B2 Selective deposition for integrated circuit interconnect structures TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2026-02-10 US claimed
US-20260035573-A1 SEALANTS FOR INHIBITING CORROSION BOEING CO (US) 2026-02-05 US claimed
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) 2025-07-24 US claimed
US-12351702-B2 Compositions and methods for producing electrically conductive coordination polymers and uses thereof CLARKSON UNIVERSITY (US) 2025-07-08 US claimed
CN-120166857-A Photoelectric device, preparation method thereof and display device TCL科技集团股份有限公司 2025-06-17 CN claimed
CN-116987331-B Flame-retardant antistatic rubber V belt and preparation method thereof 浙江四海新材料股份有限公司 2025-05-27 CN claimed
WO-2025103355-A1 ANTI-EGFR AND -HER3 BISPECIFIC ANTIBODY-DRUG CONJUGATE AND USE THEREOF 信达生物制药(苏州)有限公司 2025-05-22 WO claimed
WO-2025086728-A1 COPPER PLATING SOLUTION, METALLIC COPPER LAYER COMPRISING SAME AND USE OF COPPER PLATING SOLUTION 江阴纳力新材料科技有限公司 2025-05-01 WO claimed
CN-119900058-A Copper plating solution, metal copper layer comprising copper plating solution and application of copper plating solution 江阴纳力新材料科技有限公司 2025-04-29 CN claimed
US-4310643-A FOR USE WITH AN INTERNAL COMBUSTION ENGINE NIPPON ZEON CO., LTD. (JP) 1982-01-12 US claimed
US-4268644-A EPICHLOROHYDRIN-ETHYLENE OXIDE-UNSATURATED IPOXIDE TERPOLYMER NIPPON ZEON CO. LTD. (JP) 1981-05-19 US claimed
US-4256888-A Preparation of 2-chloropyrimidines EASTMAN KODAK COMPANY (US) 1981-03-17 US claimed
US-4163669-A CONTAINING HEAVY METAL SALT OF ORGANIC COMPOUND MITSUBISHI PAPER MILLS, LTD. (JP) 1979-08-07 US claimed
US-4144391-A REPLACING AN ACETOXY GROUP BY A SULFUR NUCLEOPHILE ELI LILLY AND COMPANY (US) 1979-03-13 US claimed
US-4136074-A THIOL-CONTAINING COMPOUND CANADA WIRE & CABLE LIMITED (CA) 1979-01-23 US claimed
US-4075021-A COMPOUND WHICH RELEASES A SUBSTANCE WHICH PROMOTES BLEACHING OF DEVELOPED SILVER KONISHIROKU PHOTO INDUSTRY CO., LTD. (JA) 1978-02-21 US claimed
US-4012372-A MONOAZO DISPERSE DYES EASTMAN KODAK COMPANY (US) 1977-03-15 US claimed
US-3980634-A Phthalimidyl-azo aniline type compounds and polyester fibers dyed therewith EASTMAN KODAK COMPANY (US) 1976-09-14 US claimed
US-3945829-A BINDER, COLLOIDAL SILVER, HETEROCYCLIC MERCAPTO COMPOUND AGFA-GEVAERT AKTIENGESELLSCHAFT (DT) 1976-03-23 US claimed