Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11547358 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL1274727 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL11500943 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL8055981 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL19327192 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL8959411 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL7631487 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL7716512 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL208042 | 0.94 | CA1 (0.41) | — | |
| SCHEMBL7718663 | 0.94 | CA1 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 87 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106416432-B | Wiring board | 凸版资讯股份有限公司 | 2020-03-24 | — | — | CN | claimed |
| US-10477679-B2 | Method for producing wiring board | TOPPAN FORMS CO., LTD. (JP) | 2019-11-12 | — | — | US | claimed |
| US-10074818-B2 | Transistor | TOPPAN FORMS CO., LTD. (JP) | 2018-09-11 | — | — | US | claimed |
| US-10040960-B2 | Silver ink composition, conductor and communication device | TOPPAN FORMS CO., LTD. (JP) | 2018-08-07 | — | — | US | claimed |
| EP-2599840-B1 | SILVER INK COMPOSITION AND BASE MATERIAL | TOPPAN FORMS CO LTD (JP) | 2018-07-25 | — | — | EP | claimed |
| US-20180153034-A1 | WIRING BOARD | TOPPAN FORMS CO., LTD. (JP) | 2018-05-31 | — | — | US | claimed |
| US-9371465-B2 | Silver ink composition | TOPPAN FORMS CO., LTD. (JP) | 2016-06-21 | — | — | US | claimed |
| US-9328254-B2 | Silver ink composition and substrate | TOPPAN FORMS CO., LTD. (JP) | 2016-05-03 | — | — | US | claimed |
| US-20150259557-A1 | SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE | TOPPAN FORMS CO., LTD (JP) | 2015-09-17 | — | — | US | claimed |
| US-20150008376-A1 | Silver Ink Composition | TOPPAN FORMS CO., LTD (JP) | 2015-01-08 | — | — | US | claimed |
| EP-2599840-A1 | SILVER INK COMPOSITION AND BASE MATERIAL | Toppan Forms Co., Ltd. (JP) | 2013-06-05 | — | — | EP | claimed |
| US-20130121872-A1 | Silver Ink Composition and Substrate | TOPPAN FORMS CO., LTD. (JP) | 2013-05-16 | — | — | US | claimed |
| EP-1905756-B1 | SILVER BETA-KETOCARBOXYLATE DERIVATIVES FOR FORMING SILVER METAL | UNIV OSAKA (JP) | 2013-02-27 | — | — | EP | claimed |
| US-7683195-B2 | Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof | Osaka Industrial Promotional Organization (JP) | 2010-03-23 | — | — | US | claimed |
| US-20090209693-A1 | Silver Beta-Ketocarboxylate, Material Comprising the Same for Forming Silver Metal, and Use Thereof | OSAKA INDUSTRIAL PROMOTION (JP) | 2009-08-20 | — | — | US | claimed |
| WO-2007119966-A9 | RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS | LG CHEMICAL LTD (KR) | 2008-10-02 | — | — | WO | claimed |
| EP-1905756-A1 | SILVER BETA-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF | OSAKA UNIVERSITY (JP) | 2008-04-02 | — | — | EP | claimed |
| WO-2007119966-A1 | RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS | LG CHEM, LTD. (KR) | 2007-10-25 | — | — | WO | claimed |
| US-20070243363-A1 | Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods | LG CHEM, LTD. (KR) | 2007-10-18 | — | — | US | claimed |
| US-12119131-B2 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-10-15 | — | — | US | disclosed |
| EP-4424441-A1 | SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY | Toppan Holdings Inc. (JP) | 2024-09-04 | — | — | EP | disclosed |
| US-20240278321-A1 | SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY | TOPPAN HOLDINGS INC. (JP) | 2024-08-22 | — | — | US | disclosed |
| US-12017392-B2 | Overmoulded printed electronic parts and methods for the manufacture thereof | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2024-06-25 | — | — | US | disclosed |
| CN-118159373-A | Sintered material, metal sintered body, method for producing sintered material, method for producing joined body, and joined body | 凸版控股株式会社 | 2024-06-07 | — | — | CN | disclosed |
| CN-112789331-B | UV sinterable molecular inks and processing thereof using broad spectrum UV light | 加拿大国家研究委员会 | 2024-05-28 | — | — | CN | disclosed |
| US-20240045331-A1 | PHOTOSENSITIVE RESIN COMPOSITION, BOARD WITH CONDUCTIVE PATTERN, ANTENNA ELEMENT, PRODUCTION METHOD FOR IMAGE DISPLAY DEVICE, AND PRODUCTION METHOD FOR TOUCH PANEL | TORAY INDUSTRIES, INC. (JP) | 2024-02-08 | — | — | US | disclosed |
| US-11873413-B2 | UV-sinterable molecular ink and processing thereof using broad spectrum UV light | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2024-01-16 | — | — | US | disclosed |
| US-11873409-B2 | Printable molecular ink | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2024-01-16 | — | — | US | disclosed |
| EP-3580284-B1 | PRINTABLE MOLECULAR INK | NAT RES COUNCIL CANADA (CA) | 2023-10-25 | — | — | EP | disclosed |
| US-20230274853-A1 | THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF | CLAP CO., LTD (KR) | 2023-08-31 | — | — | US | disclosed |
| WO-2023074580-A1 | SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY | トッパン・フォームズ株式会社 | 2023-05-04 | — | — | WO | disclosed |
| CN-112301346-B | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2023-02-28 | — | — | CN | disclosed |
| WO-2022012937-A1 | THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF | BASF SE (DE) | 2022-01-20 | — | — | WO | disclosed |
| EP-3941167-A1 | THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF | BASF SE (DE) | 2022-01-19 | — | — | EP | disclosed |
| US-11217359-B2 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | SENJU METAL INDUSTRY CO., LTD. (JP) | 2022-01-04 | — | — | US | disclosed |
| US-20210366627-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | SENJU METAL INDUSTRY CO., LTD. (JP) | 2021-11-25 | — | — | US | disclosed |
| US-20210316485-A1 | OVERMOULDED PRINTED ELECTRONIC PARTS AND METHODS FOR THE MANUFACTURE THEREOF | E2IP TECHNOLOGIES INC. (CA) | 2021-10-14 | — | — | US | disclosed |
| US-20210301166-A1 | UV-SINTERABLE MOLECULAR INK AND PROCESSING THEREOF USING BROAD SPECTRUM UV LIGHT | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2021-09-30 | — | — | US | disclosed |
| EP-3830200-A1 | UV-SINTERABLE MOLECULAR INK AND PROCESSING THEREOF USING BROAD SPECTRUM UV LIGHT | National Research Council of Canada (CA) | 2021-06-09 | — | — | EP | disclosed |
| CN-112789331-A | UV sinterable molecular inks and processing thereof using broad spectrum UV light | 加拿大国家研究委员会 | 2021-05-11 | — | — | CN | disclosed |
| CN-111032912-B | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-112301346-A | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2021-02-02 | — | — | CN | disclosed |
| US-20200381136-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-12-03 | — | — | US | disclosed |
| US-10849231-B2 | Laminate and circuit board | TOPPAN FORMS CO., LTD. (JP) | 2020-11-24 | — | — | US | disclosed |
| EP-3660185-A1 | METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART | Senju Metal Industry Co., Ltd (JP) | 2020-06-03 | — | — | EP | disclosed |
| CN-111032912-A | Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part | 千住金属工业株式会社 | 2020-04-17 | — | — | CN | disclosed |
| WO-2020071471-A1 | METHOD FOR BONDING METALLIC MEMBERS, BONDED METALLIC-MEMBER OBJECT, AND CIRCUIT BOARD | トッパン・フォームズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| CN-106416432-B | Wiring board | 凸版资讯股份有限公司 | 2020-03-24 | — | — | CN | disclosed |
| WO-2020026207-A1 | UV-SINTERABLE MOLECULAR INK AND PROCESSING THEREOF USING BROAD SPECTRUM UV LIGHT | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2020-02-06 | — | — | WO | disclosed |
| US-10477679-B2 | Method for producing wiring board | TOPPAN FORMS CO., LTD. (JP) | 2019-11-12 | — | — | US | disclosed |
| US-10074818-B2 | Transistor | TOPPAN FORMS CO., LTD. (JP) | 2018-09-11 | — | — | US | disclosed |
| US-10040960-B2 | Silver ink composition, conductor and communication device | TOPPAN FORMS CO., LTD. (JP) | 2018-08-07 | — | — | US | disclosed |
| EP-2599840-B1 | SILVER INK COMPOSITION AND BASE MATERIAL | TOPPAN FORMS CO LTD (JP) | 2018-07-25 | — | — | EP | disclosed |
| CN-105393361-B | transistor with a metal gate electrode | 凸版资讯股份有限公司 | 2018-07-06 | — | — | CN | disclosed |
| US-20180153034-A1 | WIRING BOARD | TOPPAN FORMS CO., LTD. (JP) | 2018-05-31 | — | — | US | disclosed |
| US-9803098-B2 | Conductive ink | PESOLVE CO., LTD. (KR) | 2017-10-31 | — | — | US | disclosed |
| US-20170129257-A1 | METALLIC DECORATION METHOD AND METALLIC DECORATION APPARATUS | MIMAKI ENGINEERING CO., LTD. (JP) | 2017-05-11 | — | — | US | disclosed |
| US-20160330835-A1 | WIRING BOARD | TOPPAN FORMS CO., LTD. (JP) | 2016-11-10 | — | — | US | disclosed |
| EP-3085811-A1 | LOW TEMPERATURE AG-COMPOSITIONS | Heraeus Deutschland GmbH & Co. KG (DE) | 2016-10-26 | — | — | EP | disclosed |
| US-20160286653-A1 | LAMINATE AND CIRCUIT BOARD | TOPPAN EDGE INC. (JP) | 2016-09-29 | — | — | US | disclosed |
| US-20160185990-A1 | CONDUCTIVE INK | YMT CO.,LTD. (KR) | 2016-06-30 | — | — | US | disclosed |
| US-9371465-B2 | Silver ink composition | TOPPAN FORMS CO., LTD. (JP) | 2016-06-21 | — | — | US | disclosed |
| US-20160155969-A1 | Transistor | THE UNIVERSITY OF TOKYO (JP) | 2016-06-02 | — | — | US | disclosed |
| EP-3015567-A1 | Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds | Heraeus Deutschland GmbH & Co. KG (DE) | 2016-05-04 | — | — | EP | disclosed |
| US-9328254-B2 | Silver ink composition and substrate | TOPPAN FORMS CO., LTD. (JP) | 2016-05-03 | — | — | US | disclosed |
| US-9328254-B2 | Silver ink composition and substrate | TOPPAN FORMS CO., LTD. (JP) | 2016-05-03 | — | — | US | disclosed |
| US-20150259557-A1 | SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE | TOPPAN FORMS CO., LTD (JP) | 2015-09-17 | — | — | US | disclosed |
| US-20150008376-A1 | Silver Ink Composition | TOPPAN FORMS CO., LTD (JP) | 2015-01-08 | — | — | US | disclosed |
| EP-2599840-A1 | SILVER INK COMPOSITION AND BASE MATERIAL | Toppan Forms Co., Ltd. (JP) | 2013-06-05 | — | — | EP | disclosed |
| EP-2599840-A1 | SILVER INK COMPOSITION AND BASE MATERIAL | Toppan Forms Co., Ltd. (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-20130121872-A1 | Silver Ink Composition and Substrate | TOPPAN FORMS CO., LTD. (JP) | 2013-05-16 | — | — | US | disclosed |
| US-20130121872-A1 | Silver Ink Composition and Substrate | TOPPAN FORMS CO., LTD. (JP) | 2013-05-16 | — | — | US | disclosed |
| CN-103038294-A | Silver ink composition and substrate | TOPPAN FORMS CO LTD | 2013-04-10 | — | — | CN | disclosed |
| EP-1905756-B1 | SILVER BETA-KETOCARBOXYLATE DERIVATIVES FOR FORMING SILVER METAL | UNIV OSAKA (JP) | 2013-02-27 | — | — | EP | disclosed |
| WO-2012014933-A1 | SILVER INK COMPOSITION AND BASE MATERIAL | トッパン・フォームズ株式会社 (JP) | 2012-02-02 | — | — | WO | disclosed |
| US-7683195-B2 | Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof | Osaka Industrial Promotional Organization (JP) | 2010-03-23 | — | — | US | disclosed |
| US-7683195-B2 | Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof | Osaka Industrial Promotional Organization (JP) | 2010-03-23 | — | — | US | disclosed |
| US-7682774-B2 | Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods | LG CHEM, LTD. (KR) | 2010-03-23 | — | — | US | disclosed |
| JP-2009221222-A | MATERIAL FOR FORMING METAL SILVER, METHOD FOR PRODUCING METAL SILVER AND METAL SILVER | OSAKA INDUSTRIAL PROMOTION ORGANIZATION | 2009-10-01 | — | — | JP | disclosed |
| US-20090209693-A1 | Silver Beta-Ketocarboxylate, Material Comprising the Same for Forming Silver Metal, and Use Thereof | OSAKA INDUSTRIAL PROMOTION (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090209693-A1 | Silver Beta-Ketocarboxylate, Material Comprising the Same for Forming Silver Metal, and Use Thereof | OSAKA INDUSTRIAL PROMOTION (JP) | 2009-08-20 | — | — | US | disclosed |
| WO-2007119966-A9 | RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS | LG CHEMICAL LTD (KR) | 2008-10-02 | — | — | WO | disclosed |
| EP-1905756-A1 | SILVER BETA-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF | OSAKA UNIVERSITY (JP) | 2008-04-02 | — | — | EP | disclosed |
| EP-1905756-A1 | SILVER BETA-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF | OSAKA UNIVERSITY (JP) | 2008-04-02 | — | — | EP | disclosed |
| WO-2007119966-A1 | RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS | LG CHEM, LTD. (KR) | 2007-10-25 | — | — | WO | disclosed |
| US-20070243363-A1 | Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods | LG CHEM, LTD. (KR) | 2007-10-18 | — | — | US | disclosed |
| WO-2007004437-A1 | SILVER β-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF | OSAKA INDUSTRIAL PROMOTION ORGANIZATION (JP) | 2007-01-11 | — | — | WO | disclosed |
| WO-2007004437-A1 | SILVER β-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF | OSAKA INDUSTRIAL PROMOTION ORGANIZATION (JP) | 2007-01-11 | — | — | WO | disclosed |