⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1539094 | 0.87 | — | — | |
| SCHEMBL1701805 | 0.87 | — | — | |
| SCHEMBL8610119 | 0.87 | — | — | |
| SCHEMBL29354069 | 0.82 | — | — | |
| SCHEMBL115408 | 0.82 | — | — | |
| SCHEMBL1354341 | 0.78 | — | — | |
| SCHEMBL8507745 | 0.67 | — | — | |
| SCHEMBL2241382 | 0.67 | — | — | |
| SCHEMBL9120253 | 0.67 | — | — | |
| SCHEMBL709892 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4127792-A | Luminescent semiconductor display device including gate control electrodes | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1978-11-28 | — | — | US | claimed |
| US-8535985-B2 | Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-17 | — | — | US | disclosed |
| US-8531024-B2 | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-10 | — | — | US | disclosed |
| US-8525214-B2 | Semiconductor chip assembly with post/base heat spreader with thermal via | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-03 | — | — | US | disclosed |
| US-8415703-B2 | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-04-09 | — | — | US | disclosed |
| US-8354283-B2 | Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-01-15 | — | — | US | disclosed |
| US-8354688-B2 | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-01-15 | — | — | US | disclosed |
| US-8329510-B2 | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-12-11 | — | — | US | disclosed |
| US-8324723-B2 | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-12-04 | — | — | US | disclosed |
| US-8314438-B2 | Semiconductor chip assembly with bump/base heat spreader and cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-11-20 | — | — | US | disclosed |
| US-20110037094-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND CAVITY IN BUMP | BRIDGE SEMICONDUCTOR CORPORATION | 2011-02-17 | — | — | US | disclosed |
| US-20110003437-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE | LIN CHARLES W C | 2011-01-06 | — | — | US | disclosed |
| US-20100327310-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/FLANGE HEAT SPREADER AND CAVITY IN FLANGE | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2010-12-30 | — | — | US | disclosed |
| US-20100289054-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND ADHESIVE BETWEEN BASE AND TERMINAL | BRIDGE SEMICONDUCTOR CORPORATION | 2010-11-18 | — | — | US | disclosed |
| US-20100203679-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY OVER THE POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-08-12 | — | — | US | disclosed |
| US-20100190300-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPREADER AND A CAVITY IN THE BASE | BRIDGE SEMICONDUCTOR CORPORATION | 2010-07-29 | — | — | US | disclosed |
| US-20100190297-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY IN THE POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-07-29 | — | — | US | disclosed |
| US-20100181594-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2010-07-22 | — | — | US | disclosed |
| US-20100155769-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE | BRIDGE SEMICONDUCTOR CORPORATION | 2010-06-24 | — | — | US | disclosed |
| US-20100155768-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY IN POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-06-24 | — | — | US | disclosed |